Abstract: An interconnect formed using a stiff layer having a plurality of holes extending there through. A first flexible layer is bonded to a first side of the stiff layer. The first flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. A second flexible layer is bonded to a second side of the stiff layer. The second flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. Signal paths are formed in the holes, the signal paths connecting the plurality of conductive bumps on the first layer to the plurality of conductive bumps on the second layer.

Abstract: Various data capture assemblies and methods are provided. In one embodiment, a data capture assembly is provided that includes a bolster plate with an aperture attached to a multi-chip module. A pad array is disposed on the multi-chip module and is exposed through the aperture. An interposer is electrically coupled to the pad array on the multi-chip module, and a translator board is electrically coupled to the interposer. A logical analyzer interface is electrically coupled to the translator board.