Patents by Inventor Robert Warner Koon

Robert Warner Koon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260109086
    Abstract: A method of forming a bonded structure is disclosed herein. In some embodiments, a method includes curing a first part on a first tool to a first degree of cure, the first degree of cure (DOC) being a partially cured state, removing the partially cured first part from the first tool, assembling the partially cured first part and a second part into a structure, and curing the structure to form a bonded structure, where the partially cured first part is cured to a second degree of cure (DOC) that is greater than the first DOC.
    Type: Application
    Filed: October 21, 2024
    Publication date: April 23, 2026
    Inventors: Felix Nhanchau Nguyen, Yin-Farn Chen, William P. Fallon, Robert Warner Koon
  • Publication number: 20250001647
    Abstract: A pi-shaped preform, an assembly including the same, and methods of making the same are disclosed herein. In some embodiments, a pi-shaped preform includes a base component, a pair of axially elongated legs coupled to the base component to define a channel between the axially elongated legs, and wherein the base component and the pair of axially elongated legs each comprises an oriented ply stack, wherein each ply in the oriented ply stack comprises aligned continuous fibers, and wherein at least one ply in the oriented ply stack comprises stitching fibers, wherein the stitching fibers hold together the aligned continuous fibers of the at least one ply.
    Type: Application
    Filed: July 1, 2024
    Publication date: January 2, 2025
    Inventors: Felix Nhanchau Nguyen, Carl Q. Rousseau, Daniel H. Hecht, Robert Warner Koon, Tracy Bradford Colwell
  • Publication number: 20240198625
    Abstract: According to some embodiments, an interface assembly for coupling an orthogonal circuit board to a main circuit board includes a frame, signal pins, and dielectric retainers. The frame is electrically coupled to a ground signal of the orthogonal circuit board. The dielectric retainers electrically isolate the plurality of signal pins from the frame. The frame includes an interface surface configured to electrically couple the frame to a plurality of ground spring pins of a spring interposer of the main circuit board. Each particular signal pin of the interface assembly includes a pin head configured to electrically couple the particular signal pin to a particular one of a plurality of signal spring pins of the spring interposer. The interface surface of the frame and the pin heads of the plurality of signal pins form a coplanar surface.
    Type: Application
    Filed: December 14, 2022
    Publication date: June 20, 2024
    Inventors: Robert Warner Koon, Felix Nhanchau Nguyen, Daniel H. Hecht, Carl Q. Rousseau
  • Patent number: 6258431
    Abstract: A system is provided for filling a gap between adjoining coplanar first and second sheet members mounted on an outer surface of a common substrate and having juxtaposed first and second edge surfaces. A permanent gap filler member of predetermined shape and size intended for eventual permanent reception in the gap is employed for partially filling the gap. A temporary gap filler tool which includes a substitute gap filler element having substantially the same predetermined size and shape of the permanent gap filler member, has an abutting surface for contiguous engagement with the first edge surface of the first sheet member when advanced to an attached position before the permanent gap filler member is mounted in the gap, a minor gap surface facing opposite said abutting surface, and means for releasably attaching the temporary gap filler tool to the first sheet member. A minor gap is thereby defined between the temporary gap filler element and the second edge surface of the second sheet member.
    Type: Grant
    Filed: September 5, 2000
    Date of Patent: July 10, 2001
    Assignee: Northrop Grumman Corporation
    Inventors: Carl Andrew Reis, Robert Warner Koon
  • Patent number: 6136116
    Abstract: A system is provided for filling a gap between adjoining coplanar first and second sheet members mounted on an outer surface of a common substrate and having juxtaposed first and second edge surfaces. A permanent gap filler member of predetermined shape and size intended for eventual permanent reception in the gap is employed for partially filling the gap. A temporary gap filler tool which includes a substitute gap filler element having substantially the same predetermined size and shape of the permanent gap filler member, has an abutting surface for contiguous engagement with the first edge surface of the first sheet member when advanced to an attached position before the permanent gap filler member is mounted in the gap, a minor gap surface facing opposite said abutting surface, and means for releasably attaching the temporary gap filler tool to the first sheet member. A minor gap is thereby defined between the temporary gap filler element and the second edge surface of the second sheet member.
    Type: Grant
    Filed: November 12, 1998
    Date of Patent: October 24, 2000
    Assignee: Northrop Grumman Corporation
    Inventors: Carl Andrew Reis, Robert Warner Koon