Abstract: A method for affecting film growth on a substrate during a deposition process includes steps of: applying a first voltage or current to a first zone of a chuck adapted to hold the substrate in position, the film growth on at least a portion of the substrate proximate the first zone being affected as a function of a level of the first voltage or current; and applying a second voltage or current to a second zone of the chuck, the film growth on at least a portion of the substrate proximate the second zone being affected as a function of a level of the second voltage or current.

Abstract: An electromagnetic polish head (100) comprises at least one electromagnet. An embodiment may also include the addition of a slurry component or components that can be affected by an electromagnetic field. During polishing or planarization, a field or fields may be generated by the polish head (100) to affect the polishing of a wafer by attracting or repelling the slurry to a portion or portions of the substrate.