Abstract: A method for producing at least one semiconductor component group, in particular a SiC semiconductor component group, includes the step of producing a number of semiconductor components on a substrate, particularly on a wafer. The individual semiconductor components are tested for detecting operative semiconductor components. At least one semiconductor component group is assembled, which is formed of a number of operative semiconductor components and which forms a coherent flat structure. The operative semiconductor components of the semiconductor component group are electrically connecting in parallel.

Abstract: A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.

Abstract: An electric functional layer is produced on a surface of a substrate, having at least an electronic component, particularly a semiconductor chip, provided thereof. The electric functional layer is formed using particles in powder of an electrically conductive material. The functional layer is blown on the surface of the substrate to form a thick and strong adhesive layer on impact with the substrate.

Abstract: One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

Abstract: An electric functional layer is produced on a surface of a substrate, having at least an electronic component, particularly a semiconductor chip, provided thereof. The electric functional layer is formed using particles in powder of an electrically conductive material. The functional layer is blown on the surface of the substrate to form a thick and strong adhesive layer on impact with the substrate.

Abstract: A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.

Abstract: A device, especially a piezo stack (2) has a plurality of stacked actuator or sensor layers with electrodes (5) or piezo stack (2) contacts. A flexible lead frame (1) is electrically connected to the electrodes (5).

Abstract: One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

Abstract: A device, especially a piezo stack (2) has a plurality of stacked actuator or sensor layers with electrodes (5) or piezo stack (2) contacts. A flexible lead frame (1) is electrically connected to the electrodes (5).

Abstract: A device is disclosed with at least one electrically insulating layer on which at least one conductor structure made of electrically conductive material is placed. In at least one embodiment, the conductor structure on the side facing the insulating layer has at least one elevation that is accommodated in at least one recess in the insulating layer.

Abstract: A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.

Abstract: A method for producing at least one semiconductor component group, in particular a SiC semiconductor component group, includes the step of producing a number of semiconductor components on a substrate, particularly on a wafer. The individual semiconductor components are tested for detecting operative semiconductor components. At least one semiconductor component group is assembled, which is formed of a number of operative semiconductor components and which forms a coherent flat structure. The operative semiconductor components of the semiconductor component group are electrically connecting in parallel.

Abstract: In the illustrated embodiments, an elastomer body has a relatively thin metal layer overlying the elastomer surface to be loaded so as to prevent adhesion at the elastomer surface in spite of a long period of dwell in contact with a relatively more rigid cooperating part such as a hard rubber stop. In a basic form, a thin metal sleeve may encircle a cylindrical elastomer body. The outer surface of the sleeve may be grooved for extra adhesion resistance. In a further development, the sleeve is formed as a helical wire spring which may be confined between two flanges integral with the elastomer body.

Abstract: A printer carriage as for a teleprinter or a typewriter is carried on a toothed belt along a printing row, the belt being driven in forward and reverse directions by a reversible stepping motor operating without feedback. Deceleration and precise stoppage of the carriage during carriage return movements are governed by fixed signal generators along the printing row and a ring counter in the motor control unit. Stoppage occurs upon coincidence of a signal from the ring counter and a signal from a generator at the row commence position, combined in a logical AND- circuit.

Abstract: An arrangement for scanning a disc-shaped type carrier in a code controlled printing device has a stepping motor which is controllable in the forward and backward directions for setting the type carrier. The count of a ring counter contained in the stepping motor control, and which is set in accordance with the setting of the stepping motor, is compared, as a binary combination, in a comparator device with a binary combination assigned to a specific character, and in the event of parity of the two binary combinations, an output pulse is emitted. A scanning sector is arranged on the type carrier and extends over a plurality of characters including the specific character, preferably centrally located along the scanning sector. A scanning device produces a scanning pulse in response to rotation of the sector to or past the scanning device and the scanning pulse is conjunctively linked with the output pulse of the comparator for utilization in system synchronization.