Patents by Inventor Robert Wenzel
Robert Wenzel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190317944Abstract: According to certain aspects, the invention provides advanced software architected to leverage the operational data volumes from IT, intelligent devices and machines supported and maintained by IT or end users for use by business groups or individuals in order to create a low Total Cost of Operation (TCO) processes that enable data sources to be transferred, modified, and computations performed based on the needs of the end users operating independently or within the enterprise data assets To cost effectively capture any data source and place within the enterprise' standard data structures and processes. According to another aspect, the invention provides the end user options with capability to re-structure, copy, and re-position data for corporate and end users for ongoing corporate applications via a selection of options methodology that is supported by usage of the end user versions of spreadsheet software.Type: ApplicationFiled: November 14, 2018Publication date: October 17, 2019Inventors: Kevin Deremigio, Trent Wenzel, Robert Wenzel
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Patent number: 9974174Abstract: Embodiments of an interconnect structure are provided, the interconnect structure including: a reference plane structure having a first major surface and a second major surface opposite the first major surface, the reference plane structure including a plurality of through holes from the first major surface to the second major surface; a plurality of conductive columns, each conductive column centered within a through hole; and a plurality of isolation structures, each isolation structure fills an annular region within the through hole between each conductive column and surrounding portion of the reference plane structure.Type: GrantFiled: October 26, 2016Date of Patent: May 15, 2018Assignee: NXP USA, Inc.Inventors: Robert Wenzel, Tingdong Zhou, David Clegg
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Publication number: 20180116050Abstract: Embodiments of an interconnect structure are provided, the interconnect structure including: a reference plane structure having a first major surface and a second major surface opposite the first major surface, the reference plane structure including a plurality of through holes from the first major surface to the second major surface; a plurality of conductive columns, each conductive column centered within a through hole; and a plurality of isolation structures, each isolation structure fills an annular region within the through hole between each conductive column and surrounding portion of the reference plane structure.Type: ApplicationFiled: October 26, 2016Publication date: April 26, 2018Inventors: Robert WENZEL, Tingdong Zhou, David Clegg
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Publication number: 20120089562Abstract: The invention provides advanced software architected to leverage the operational data volumes from information technology (IT), intelligent devices and machines supported and maintained by IT or end users for use by business groups or individuals in order to create low Total Cost of Operation (TCO) processes that enable data sources to be transferred, modified, and computations performed based on the needs of the end users operating independently or within the enterprise data assets to cost-effectively capture any data source and place that within the enterprise's standard data structures and processes. The invention provides the end user options with capability to re-structure, copy, and re-position data for ongoing corporate applications via a selection of options methodology that is supported by usage of the end user's versions of spreadsheet software.Type: ApplicationFiled: October 4, 2011Publication date: April 12, 2012Applicant: Sempras Software, Inc.Inventors: Kevin Deremigio, Trent Wenzel, Robert Wenzel
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Publication number: 20090257687Abstract: A package for cooking includes an inner ply and an outer ply laminated to the inner ply. The inner ply contact foodstuffs contained within the package. The inner ply is a paper-based product having a wet tensile strength property such that it will not deteriorate in the presence of high-moisture foods. The paper-based product also has a scorching temperature above the temperature of the foodstuffs when heated. The outer ply includes a polymer film.Type: ApplicationFiled: April 11, 2008Publication date: October 15, 2009Applicant: BIRDS EYE FOODS, INC.Inventor: Robert Wenzel Mitchell
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Patent number: 7308956Abstract: A rotary cutter assembly constructed in accordance with this method of securing a rotary cutter to a body has a cutter pocket with a first shoulder and a truncated second shoulder. A receptacle extends into the first shoulder. A first retainer retains a first axle end of the rotary cutter and engages the first shoulder to prevent axial movement in a first direction. A projection on the first retainer engages the receptacle to prevent removal of the first retainer radially from the cutter pocket. A second retainer retains a second axle end of the rotary cutter. The second retainer has a step down portion engaging the truncated second shoulder of the cutter pocket to prevent axial movement in a second direction. A locking ring overlies the truncated second shoulder and the step down portion of the second retainer to prevent removal of the second retainer radially from the cutter pocket.Type: GrantFiled: September 20, 2005Date of Patent: December 18, 2007Inventors: William R. Wenzel, Robert Wenzel
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Publication number: 20070212813Abstract: Methods and apparatus are provided for an electronic assembly (57, 59, 67), comprising: providing multiple electronic devices (32) with primary faces (33) having electrical contacts (39), opposed rear faces (35) and edges (34) therebetween. The devices are mounted primary faces down on a temporary support (7) in openings (48) in a substantially planar sheet (44) attached to the support (70). A plastic encapsulation (36) is formed in contact with at least the lateral edges (34) of the electronic devices (32) and edges (74) of the openings (48). The plastic encapsulation (36) is at least partially cured and the devices (32), sheet (44) and plastic encapsulation (36) separated from the temporary support (70). The devices (32), sheet (44) and plastic encapsulation (36) are desirably but not essentially mounted on a carrier (46) with the primary faces (33) and electrical contacts (39) exposed.Type: ApplicationFiled: March 10, 2006Publication date: September 13, 2007Inventors: Owen Fay, Lizabeth Keser, George Leal, Robert Wenzel
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Patent number: 7222563Abstract: The steam generating assembly of the present invention subjects a food product, such as a sandwich bun, to a controlled burst of low pressure steam in order to quickly and uniformly raise the temperature of the food product to its desired serving temperature or higher. By raising the temperature to above the desired serving temperature, the storage time of a pre-assembled food product, such as a fast food sandwich may be extended without sacrificing the quality or freshness of the product. The invention claims a steam generating assembly for steam heating a pre-processed food product.Type: GrantFiled: February 24, 2003Date of Patent: May 29, 2007Assignee: Burger King CorporationInventors: John Reckert, Jeff Cook, Duane Crisp, Terry Peter, Rhonda Sward, Robert Wenzel
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Publication number: 20070102828Abstract: Fine pitch contacts are achieved by using traces that extend to the contacts without requiring capture pads at the contact pads. Capture pads are desirably avoided because they have a diameter greater than the line to which they are attached. Preferably, adjacent contact pads are present in the same opening in the dielectric. The traces to the contact pads are in a line so that no widening is required where the lines make contact to the contact pads. The lines can be widened before they get to the contact pads but at the contact pads, they are substantially at the minimum width for the line. Thus, the contact pads can be at a pitch much lower than if capture pads were used.Type: ApplicationFiled: November 7, 2005Publication date: May 10, 2007Inventors: Robert Wenzel, George Leal
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Publication number: 20060278432Abstract: A rotary cutter assembly constructed in accordance with this method of securing a rotary cutter to a body has a cutter pocket with a first shoulder and a truncated second shoulder. A receptacle extends into the first shoulder. A first retainer retains a first axle end of the rotary cutter and engages the first shoulder to prevent axial movement in a first direction. A projection on the first retainer engages the receptacle to prevent removal of the first retainer radially from the cutter pocket. A second retainer retains a second axle end of the rotary cutter. The second retainer has a step down portion engaging the truncated second shoulder of the cutter pocket to prevent axial movement in a second direction. A locking ring overlies the truncated second shoulder and the step down portion of the second retainer to prevent removal of the second retainer radially from the cutter pocket.Type: ApplicationFiled: September 20, 2005Publication date: December 14, 2006Inventors: William Wenzel, Robert Wenzel
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Publication number: 20060257542Abstract: A flexible automatic broiler and method of use for variable batch cooking for particular use in quick serve and fast food service restaurants. The automatic cooking devices include a conveyorized cooking surface for alignment and discharge of food products, an altering/pulsating infrared energy radiation heat sources, and a control system. The arrangement and method facilitate a combination of batch preparation and made-to-order assembly of fast-food sandwiches.Type: ApplicationFiled: May 13, 2005Publication date: November 16, 2006Inventors: Jeffrey Cook, Robert Wenzel, Mark Finck, Steven Shei, Clement Luebke
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Publication number: 20060192301Abstract: A semiconductor device includes a semiconductor die having a plurality of contact pad sites, a plurality of contact pads, an encapsulant barrier, and an encapsulant. A plurality of contact pads is in electrical contact with a predetermined corresponding different one of the contact pad sites. An encapsulant barrier is positioned at an outer perimeter of the semiconductor die. The encapsulant barrier has a height that is as high as or greater than a highest of the plurality of contact pads. The encapsulant barrier is in physical contact with a same surface of the semiconductor die as the contact pad sites. An encapsulant surrounds the semiconductor die and one side of the encapsulant barrier. The encapsulant is blocked from making physical contact with any of the plurality of contact pads by the encapsulant barrier when the device is encapsulated while being supported by a temporary base support layer.Type: ApplicationFiled: March 10, 2006Publication date: August 31, 2006Inventors: George Leal, Owen Fay, Robert Wenzel
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Publication number: 20060012036Abstract: A circuit device (15) is placed within an opening of a conductive layer (10) which is then partially encapsulated with an encapsulant (24) so that the active surface of the circuit device (15) is coplanar with the conductive layer (10). At least a portion of the conductive layer (10) may be used as a reference voltage plane (e.g. a ground plane). Additionally, a circuit device (115) may be placed on a conductive layer (100) such that an active surface of circuit device (115) is between conductive layer (100) and an opposite surface of circuit device (115). The conductive layer (100) has at least one opening (128) to expose the active surface of circuit device (115). The encapsulant (24, 126, 326) may be electrically conductive or electrically non-conductive.Type: ApplicationFiled: July 19, 2005Publication date: January 19, 2006Inventors: George Leal, Jie-Hua Zhao, Edward Prack, Robert Wenzel, Brian Sawyer, David Wontor, Marc Mangrum
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Publication number: 20050242425Abstract: A semiconductor device includes a semiconductor die having a plurality of contact pad sites, a plurality of contact pads, an encapsulant barrier, and an encapsulant. A plurality of contact pads is in electrical contact with a predetermined corresponding different one of the contact pad sites. An encapsulant barrier is positioned at an outer perimeter of the semiconductor die. The encapsulant barrier has a height that is as high as or greater than a highest of the plurality of contact pads. The encapsulant barrier is in physical contact with a same surface of the semiconductor die as the contact pad sites. An encapsulant surrounds the semiconductor die and one side of the encapsulant barrier. The encapsulant is blocked from making physical contact with any of the plurality of contact pads by the encapsulant barrier when the device is encapsulated while being supported by a temporary base support layer.Type: ApplicationFiled: April 30, 2004Publication date: November 3, 2005Inventors: George Leal, Owen Fay, Robert Wenzel
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Publication number: 20050199427Abstract: A drilling on gauge sub including a tubular housing having a first end, a second end and an exterior surface. Coupling means are positioned at both the first end and the second end of the tubular housing to couple the tubular housing to other components of a drill string. At least three cavities are provided in the exterior surface of the tubular housing. Each of the cavities having a first end and a second end. Reamer cutters are secured within each of the at least three cavities. The reamer cutters including cutters mounted on rotatably mounted rollers.Type: ApplicationFiled: March 9, 2005Publication date: September 15, 2005Inventors: William Wenzel, Robert Wenzel
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Publication number: 20040166217Abstract: The steam generating assembly of the present invention subjects a food product, such as a sandwich bun, to a controlled burst of low pressure steam in order to quickly and uniformly raise the temperature of the food product to its desired serving temperature or higher. By raising the temperature to above the desired serving temperature, the storage time of a pre-assembled food product, such as a fast food sandwich may be extended without sacrificing the quality or freshness of the product. The invention claims a steam generating assembly for steam heating a pre-processed food product.Type: ApplicationFiled: February 24, 2003Publication date: August 26, 2004Inventors: John Reckert, Jeff Cook, Duane Crisp, Terry Peter, Rhonda Sward, Robert Wenzel
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Patent number: 5267905Abstract: A Sealed Downhole Motor Drive Shaft Universal Joint Assembly consisting of a housing with an interior and an exterior surface. The interior has an end wall and side walls. The end wall has an elongate projection with a concave terminus. The side walls have a plurality of slots. A shaft is provided having an exterior surface and opposed ends. Each of the ends has a central cavity with a substantially concave end wall. The exterior surface of the drive shaft has a plurality of annularly spaced pockets adjacent each end. The pockets are in substantial alignment with the end wall of the central cavity. Each end of the drive shaft is telescopically received within one of the housings. A thrust ball is positioned between the concave terminus of the elongate projection of the housing and the concave end wall of the central cavity of the shaft thereby transmitting thrust loads between the housing and the shaft while permitting omni-directional relative movement of the housing and the shaft.Type: GrantFiled: August 10, 1990Date of Patent: December 7, 1993Inventors: Douglas Wenzel, Robert Wenzel, William Wenzel
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Patent number: 5052501Abstract: An adjustable bent housing consisting of an inner housing telescopically received within an outer housing. A sleeve is provided having an angularly offset clutch face. Spline non-rotatably couple an interior surface of the sleeve with an exterior surface of the inner housing. The sleeve is axially slidable along the exterior surface of the inner housing between an inoperative position wherein the sleeve is spaced from the outer housing and an operating position. In the operative position the angularly offset clutch face of the sleeve engages an angularly offset clutch face on the outer housing thereby non-rotatably coupling the inner housing and the outer housing in a bent position the magnitude of which is dependent upon the relative rotational positioning of the outer housing and the inner housing.Type: GrantFiled: August 10, 1990Date of Patent: October 1, 1991Inventors: Douglas Wenzel, Robert Wenzel, William Wenzel
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Patent number: 4853927Abstract: The transmission restoration for faulty operating paths is generally constituted by a direct transmission restoration or a centrally controlled transmission rerouting. In the substitute direct transmission rerouting, N restoration links are permanently assigned to M operating paths, so that when faults affect more than N operating paths, M-N operating paths do not have the possibility to switch to the restoration link. With the centrally controlled transmission rerouting the employment of the restoration link requires reporting this fault to the supervising station as well as transmitting the control message from the supervising station to the switching matrices. The time required thereto generally causes all connections through the faulty operating path to be broken.Type: GrantFiled: December 9, 1987Date of Patent: August 1, 1989Assignee: U.S. Philips CorporationInventor: Robert Wenzel