Abstract: A power distribution system includes a plurality of loads and a plurality of power sources. The power distribution system also includes an interconnect arrangement including a plurality of interconnects. The interconnects connect each load to a given number of different ones of the sources so that each load is fully powered notwithstanding failure of any one of the sources.

Abstract: Embodiments of the present invention present an apparatus coupled to an internal bus for monitoring environmental factors in a computer system including: an embedded controller having a processor; an environmental sensor that provides data related to environmental conditions; a reset generator; and a power source. A LAN interface may be configured to remotely access and control the embedded controller. Further, the internal bus may be selected from any of the following: a PCI bus, an ISA bus, a DIMM slot, a SIMM slot, a PCMCIA slot, or a server blade slot. Still further, the environmental sensor may be selected from any of the following: a DC electrical sensor; an AC electrical sensor; a temperature sensor; a humidity sensor; a force monitor sensor; a signal monitor sensor; an electrostatic discharge sensor; an activity sensor; an optical particulate sensor; a Hall Effect sensor; a global positioning sensor; or a whisker detection sensor.

Abstract: One embodiment disclosed relates to a system for power management of a group of computers. The system includes server side infrastructure (SSI) circuitry at each computer in the group and a centralized power management module (CPMM). The SSI circuitry includes local monitoring circuitry coupled to a central processing unit (CPU) of the computer. The CPMM has a management link to the SSI circuitry at each computer in the group. The local circuitry at each computer monitors power consumption at the CPU of that computer and transmits power consumption data to the CPMM. The CPMM applies a set of rules to the power consumption data to determine when and at which computers to enable and disable a CPU power throttling mode.

Abstract: One aspect of the present invention provides a server card that is removably insertable into a server chassis. An electronic power switching mechanism is disposed on the server card and is configured to cause three power states of the server card including a fully operational state, a standby state, and a fully shutdown state. In the fully operational state, a system power of the server card is enabled and a standby power of the server card is enabled. In the standby state, a system power of the server card is disabled and the standby power of the server card is enabled. In a shutdown state, the system power of the server card is disabled and the standby power of the server card is disabled.

Abstract: A power distribution system provides power source redundancy. The system includes a bank of loads and first and second groups of power sources. An interconnect arrangement includes a plurality of interconnects that connect each load to one or more sources of both the first and second groups of sources so as to be fully powered by sources of both the first and second groups of sources and such that if any one source or all sources of one of the groups of sources fails, all of the loads remain fully powered.

Abstract: An apparatus in one example comprises a reversible fan of an electronic module that rotates in a clockwise direction if the electronic module is communicatively coupled in a first position and a counterclockwise direction if the electronic module is communicatively coupled in a second position.

Abstract: One embodiment disclosed relates to an apparatus for supplying redundant power to a plurality of computer systems. The apparatus includes at least one bus bar, a plurality of power supplies each supplying power at a same voltage level, a plurality of power switches, and a power supply management controller. Power inputs of the computer systems are connected to the at least one bus bar. The power supplies are selectively connected to the at least one bus bar using the power switches. The power supply management controller controls the power switches such that the power is supplied redundantly to the computer systems.

Abstract: A power supply comprises a chassis, a plurality of alternating current (AC) power receptacles formed into the chassis, and power supply circuit contained within the chassis and selectively coupled to ones of the plurality of AC power receptacles.

Abstract: A printed circuit board comprises a conductive layer and a via transecting the conductive layer. The printed circuit board comprises a pattern of conductive material having a plurality of voids in the conductive layer near the via.

Abstract: A multi stage mounting printed circuit board system and method is presented. In one embodiment, a multi stage mounting printed circuit board system includes a first printed circuit board for mounting electrical components on. A first printed circuit board interface component is coupled to the first printed circuit board. The first printed circuit board interface component communicatively couples the first printed board to a second printed board via a second printed circuit board interface component. A plurality of printed circuit board extractors are coupled to the first printed circuit board. The plurality of printed circuit board extractors couple the first printed circuit board to card guides (e.g., a single pair of card guides in which the second printed circuit board is mounted).

Abstract: A power system provides for redundant input power sources. The power system includes a plurality of inputs that are connectable to a plurality of input sources and an OR circuit coupled to the source inputs. The OR circuit ORs the input sources to provide a source voltage. The power control circuit that is responsive to sufficient source voltage and other commands provides a working voltage to mid- and low-rail converters to provide supply voltages for use by a load.

Abstract: A device for removing heat from an electronic component, comprising a heat sink that can be coupled to the electronic component and conduct heat therefrom. A finned appurtenance coupled to the heat sink can transfer the heat into a fluid medium. The fins are oriented at an angle with respect to several flow streams of the fluid medium across the fins. Each flow stream follows a unique direction.

Abstract: A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.

Abstract: A printed circuit board includes a first conductive plane and a second conductive plane substantially parallel to the first conductive plane. The printed circuit board includes a via signal barrel transecting the first and second conductive planes and a first anti-pad positioned between the first conductive plane and the via signal barrel. The first anti-pad has a first voided area. The printed circuit board includes a second anti-pad positioned between the second conductive plane and the via signal barrel. The second anti-pad has a second voided area. The first voided area does not completely overlap the second voided area.

Abstract: An apparatus for heat dissipation in a chassis housing an electronic system, and a method for implementing the same. The apparatus comprises a heat sink base for collecting thermal heat. The apparatus further comprises a fin thermally coupled to the heat sink base for dissipating the thermal heat. The fin is arranged in the chassis to direct air flow from a first direction, that is originally directed at said fin, to a second direction.

Abstract: A power supply comprises a chassis, a plurality of alternating current (AC) power receptacles formed into the chassis, and power supply circuit contained within the chassis and selectively coupled to ones of the plurality of AC power receptacles.

Abstract: A device and method are provided for reducing impedance, impedance discontinuities, and signal-loop area in flex cables used for a signal path. In one embodiment of the invention, a flex cable is provided for reducing the impedance and length of a return-signal path. The flex cable includes a signal conductor, and a return-signal conductor not connected to ground. The flex cable may also include a ground conductor. Such a flex cable provides a shorter- and lower-impedance return-signal path between a signal source and receiver than do conventional flex cables. In another embodiment of the invention, a method is provided that includes the steps of delivering a signal from a signal source to a signal receiver with a flexible conductor, and returning the signal from the signal receiver to the signal source with another flexible conductor other than ground.

Abstract: A variable impedance test probe of the present invention comprises a first signal conductor, a first ground reference conductor, and a first dielectric element disposed between the first signal conductor and the first ground reference conductor. The dielectric element is configured to selectively vary an impedance of the first signal conductor relative to the ground reference conductor.

Abstract: A short card support for supporting a short printed circuit card insertable into an electronic system is disclosed. The short card support has a card guide end adapted to couple to the card guide of the electronic system and a card receptor end adapted to couple with a first edge of the short printed circuit card. A support span between the card guide end and the card receptor end permits the short card support to accommodate varying lengths of short printed circuit cards.

Abstract: A card guide of an apparatus in one example comprises a plurality of card guide portions that serve to guide a circuit board into a chassis. The plurality of card guide portions comprise a first card guide portion and a second card guide portion. The first card guide portion serves to guide the circuit board substantially along a first direction during engagement of the circuit board with the first card guide portion. The second card guide portion serves to guide the circuit board substantially along a second direction that is nonlinear with the first direction during engagement of the circuit board with the second card guide portion.