Patents by Inventor Robert William Ellenberg

Robert William Ellenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • On-bonder automatic overhang die optimization tool for wire bonding and related methods
    Patent number: 10665564
    Abstract: A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: May 26, 2020
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Aashish Shah, Robert William Ellenberg, Stephen Babinetz, Ziauddin Ahmad, Wei Qin
  • ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING AND RELATED METHODS
    Publication number: 20190027463
    Abstract: A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.
    Type: Application
    Filed: September 26, 2018
    Publication date: January 24, 2019
    Inventors: Aashish Shah, Robert William Ellenberg, Stephen Babinetz, Ziauddin Ahmad, Wei Qin
  • On-bonder automatic overhang die optimization tool for wire bonding and related methods
    Patent number: 10121759
    Abstract: A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: November 6, 2018
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Aashish Shah, Robert William Ellenberg, Stephen Babinetz, Ziauddin Ahmad, Wei Qin
  • ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING AND RELATED METHODS
    Publication number: 20170125311
    Abstract: A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.
    Type: Application
    Filed: August 11, 2016
    Publication date: May 4, 2017
    Inventors: Aashish Shah, Robert William Ellenberg, Stephen Babinetz, Ziauddin Ahmad, Wei Qin