Abstract: An improved process for fabricating emitter structures from nanowires, wherein the nanowires are coated with a magnetic material to allow useful alignment of the wires in the emitter array, and techniques are utilized to provide desirable protrusion of the aligned nanowires in the final structure. In one embodiment, nanowires at least partially coated by a magnetic material are provided, the nanowires having an average length of about 0.1 &mgr;m to about 10,000 &mgr;m. The nanowires are mixed in a liquid medium, and a magnetic field is applied to align the nanowires. The liquid medium is provided with a precursor material capable of consolidation into a solid matrix, e.g., conductive particles or a metal salt, the matrix securing the nanowires in an aligned orientation. A portion of the aligned nanowires are exposed, e.g., by etching a surface portion of the matrix material, to provide desirable nanowire tip protrusion.

Abstract: A method for making an apparatus, for example, comprises attaching at least one self-assembled monolayer to a first element formed on a substrate. Thereafter, at least one attaching layer is formed on the substrate, adjacent to the one or more self-assembled monolayers. A second element is then formed on the one or more attaching layers spaced from the first element by about a length of the one or more self-assembled monolayers.

Abstract: An optical fiber connection device is disclosed that allows for in situ variable attenuation of a signal transmitted between two optical fibers. The connection device comprises an attenuator element fabricated with an inherently compliant, elastomeric material, preferably a silicone elastomer. The elastomeric properties of the attenuator element allow for varying the thickness of the attenuator element and thereby changing the level of attenuation in situ. Silicone elastomers are preferred for fabricating the attenuator element as applicants have discovered they may be index-matched to optical transmission fibers, have a high creep modulus, exhibit relatively constant mechanical properties over a broad range of temperatures, and are reliable upon exposure to varied environmental conditions.

Abstract: The process is provided involving formation of multilayer components in which a photoresist-type material is used not only as a conventional patterning material, but also as an insulating and/or planarizing material between magnetic or electrically conductive layers. A variety of integrated CMOS/micromagnetic components are thereby capable of being formed, including components containing planar inductors and transformers. Additionally, a particular technique is used to etch gold-containing seed layers from a substrate surface without damaging an electroplated copper coil. Also provided is a magnetic material particularly useful in devices such as inductors and transformers. The material is an amorphous iron-cobalt-phosphorus alloy having a composition of CoxPyFez, where x+y+z=100, x is 5 to 15, y is 13 to 20, and z is the remainder. The alloy typically exhibits a coercivity of 0.1 to 0.

Abstract: The specification describes source/drain contact material that is compatible with organic semiconductors in thin film transistor integrated circuits. The contact material is nickel/gold wherein the nickel is plated as Ni--P on a base conductor, preferably TiN.sub.x, by electroless plating, and the gold overlay is deposited by displacement plating. It was found, unexpectedly, that forming Ni/Au contacts in this way extends the lifetime of TFT devices substantially.

Abstract: An improved optical fiber connection system comprises an attenuator element fabricated with an inherently elastomeric material, preferably a silicone elastomer. Silicone elastomers are particularly preferred for fabricating attenuator elements as they may be index-matched to optical transmission fibers, have a high creep modulus, exhibit relatively constant mechanical properties over a broad range of temperatures, and are reliable upon exposure to varied environmental conditions. Preferably, a disc-like attenuator element is punch-cut from a sheet of a silicone elastomer and inserted into the sleeve of an optical connector apparatus adjacent the end portion of an optical fiber to provide a simplified method of fabrication. Alternatively, the silicone attenuator element may be fabricated by liquid injection molding technology. The approximate reflectance of the inventive silicone attenuators at wavelengths of about 1310 nm measured at 23.degree. C. is less than -50 dB.

Abstract: Gold is useful for infrared polarization-insensitive mirrors on silica. However, gold does not adhere to bare silica. The adherence is enhanced by depositing an optically thin glue layer of Ni--P on a silica surface after sensitization of the surface and activation. The Ni--P layer has a thickness sufficient to enhance adherence of gold to the surface of silica, but insufficient to act as a barrier to the passage of infrared radiation to or from the gold layer. One measure of the Ni--P thickness is the absorbance of the glue layer of >0.008 at 550 nm (>0.003 at 850 nm) as measured by a spectrophotometer. A 100-150 nm thick gold layer, deposited on this adhesion layer, adheres well enough to pass the commonly used "Scotch tape adhesion test". The ability to make gold adhere to silica with very low optical loss is useful in fabrication of lightwave devices which require the use of reflecting surfaces, such as an optical fibers or waveguides.

Abstract: Gold is useful for infrared polarization-insensitive mirrors on silica. However, gold does not adhere to bare silica. The adherence is enhanced by depositing an optically thin glue layer of Ni-P on a silica surface after sensitization of the surface with SnF.sub.2 and activation with PdCl.sub.2 /HCl. The Ni-P layer is deposited in a thickness sufficient to enhance adherence of gold to the surface of silica but insufficient to act as a barrier to the passage of infrared radiation to or from the gold layer. One measure of the Ni-P thickness is the absorbance of the glue layer of >0.008 at 550 nm (>0.003 at 850 nm) as measured by a spectrophotometer. A 100-150 nm thick gold layer, deposited by e-beam deposition on this adhesion layer, adheres well enough to pass the commonly used "Scotch tape adhesion test". The ability to make gold adhere to silica with very low optical loss is useful in fabrication of lightwave devices which require the use of reflecting surfaces, such as on optical fibers or waveguides.

Abstract: This invention involves a fiber probe device and a method of making it. The probe includes a relatively thick upper cylindrical portion, typically in the form of a solid right circular cylinder, terminating in a tapered portion that terminates in a relatively thin lower cylindrical portion, typically also in the form of a solid right circular cylinder, the lower portion having a width (diameter) in the approximate range of as little as approximately 0.05 .mu.m.

Abstract: This invention involves a fiber probe device and a method of making it. The probe includes a relatively thick upper cylindrical region, typically in the form of a solid right circular cylinder, terminating in a tapered region that terminates in a relatively thin lower cylindrical region (tip), typically also in the form of a solid right circular cylinder, the lower region having a width (diameter) in the approximate range 0.01 .mu.m to 150 .mu.m.

Abstract: This invention involves a fiber probe device and a method of making it. The probe includes a relatively thick upper cylindrical portion, typically in the form of a solid right circular cylinder, terminating in a tapered portion that terminates in a relatively thin lower cylindrical portion, typically also in the form of a solid right circular cylinder, the lower portion having a width (diameter) in the approximate range of as little as approximately 0.05 .mu.m.