Patents by Inventor Robert William Pasco

Robert William Pasco has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymer and ceramic composite electronic substrates
    Patent number: 6528145
    Abstract: A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: March 4, 2003
    Assignee: International Business Machines Corporation
    Inventors: Daniel George Berger, Shaji Farooq, Lester Wynn Herron, James N. Humenik, John Ulrich Knickerbocker, Robert William Pasco, Charles H. Perry, Krishna G. Sachdev
  • Method and apparatus for stacking sheets supported by carriers
    Patent number: 5876549
    Abstract: A method and apparatus for processing sheets, includes placing a sheet on a carrier to form a sheet/carrier structure, sizing the sheet/carrier structure, stacking the sheet/carrier structure in a stacking apparatus having a second sheet stacked in advance therein, so that the sheet contacts the second sheet, aligning the sheets with pins, tacking the sheet to the second sheet and removing the carrier.
    Type: Grant
    Filed: July 24, 1996
    Date of Patent: March 2, 1999
    Assignee: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, John Ulrich Knickerbocker, Robert Williams Pasco
  • Apparatus for stacking sheets by carriers
    Patent number: 5783026
    Abstract: A method and apparatus for processing sheets, includes placing a sheet on a carrier to form a sheet/carrier structure, sizing the sheet/carrier structure, stacking the sheet/carrier structure in a stacking apparatus having a second sheet stacked in advance therein, so that the sheet contacts the second sheet, aligning the sheets with pins, tacking the sheet to the second sheet and removing the carrier.
    Type: Grant
    Filed: May 24, 1995
    Date of Patent: July 21, 1998
    Assignee: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, John Ulrich Knickerbocker, Robert William Pasco
  • Apparatus and method for forming cavity substrates using flexible preform insert
    Patent number: 5746874
    Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates using at least one flexible preform insert. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic) substrates using at least one flexible preform insert that is inserted into the cavity of the MLC substrate prior to lamination and this insert helps in preventing the collapse of the shelves of the cavity during this lamination process. After the lamination process the inventive temporary preform insert is then removed.
    Type: Grant
    Filed: September 29, 1995
    Date of Patent: May 5, 1998
    Assignee: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, Robert William Pasco