Patents by Inventor Robert William Schwartz

Robert William Schwartz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6096127
    Abstract: The present invention is directed to a method for forming dielectric thin films having substantially reduced electrical losses at microwave and millimeter wave frequencies relative to conventional dielectric thin films. The reduction in losses is realized by dramatically increasing the grain sizes of the dielectric films, thereby minimizing intergranular scattering of the microwave signal due to grain boundaries and point defects. The increase in grain size is realized by heating the film to a temperature at which the grains experience regrowth. The grain size of the films can be further increased by first depositing the films with an excess of one of the compoents, such that a highly mobile grain boundary phase is formed.
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: August 1, 2000
    Assignee: Superconducting Core Technologies, Inc.
    Inventors: Duane Brian Dimos, Robert William Schwartz, Mark Victor Raymond, Husam Niman Al-Shareef, Carl Mueller, David Galt