Patents by Inventor Robert Windisch

Robert Windisch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoelectric fluid heat exchange system
    Patent number: 8001794
    Abstract: A thermoelectric heat exchange system for fluids comprising a pumping device, configured to deliver a fluid; a fluid inlet system in fluid communication with the pumping device; a fluid outlet system in fluid communication with the pumping device; a reservoir in fluid communication with the pumping device, and configured to hold a fluid; and a heat exchange system in fluid communication with the fluid delivery system, including: a heat exchange plate in fluid communication with the fluid system, comprising a channel system wherein the width of the channel system is about an order of magnitude greater than the depth of the channel system; a thermoelectric cooling module in thermal communication with the heat exchange plate; and a heat sink in communication with the thermoelectric cooling module, and configured to dissipate heat from the thermoelectric cooling module.
    Type: Grant
    Filed: February 26, 2007
    Date of Patent: August 23, 2011
    Assignee: Action Circuit Productions, Inc.
    Inventor: Robert Windisch
  • THERMOELECTRIC FLUID HEAT EXCHANGE SYSTEM
    Publication number: 20070199333
    Abstract: A thermoelectric heat exchange system for fluids comprising a pumping device, configured to deliver a fluid; a fluid inlet system in fluid communication with the pumping device; a fluid outlet system in fluid communication with the pumping device; a reservoir in fluid communication with the pumping device, and configured to hold a fluid; and a heat exchange system in fluid communication with the fluid delivery system, including: a heat exchange plate in fluid communication with the fluid system, comprising a channel system wherein the width of the channel system is about an order of magnitude greater than the depth of the channel system; a thermoelectric cooling module in thermal communication with the heat exchange plate; and a heat sink in communication with the thermoelectric cooling module, and configured to dissipate heat from the thermoelectric cooling module
    Type: Application
    Filed: February 26, 2007
    Publication date: August 30, 2007
    Inventor: ROBERT WINDISCH