Abstract: Devices and methods for determining and indicating a source of power based on a characteristic of received power are disclosed. According to an aspect, a device includes a power line interface configured to receive power from multiple power lines. The device also includes a comparator module configured to compare one or more characteristics of the received power from the plurality of power lines. The comparator module is also configured to determine whether the received power on the power lines are from the same source based on the comparison. Further, the device includes a user interface configured to indicate whether the received power on the power lines are from the same source based on the determination.

Abstract: A composite metal surface that looks metallic, but permits effective transmission of an electromagnetic field. The composite metal surface can be integrated into various electronic equipment, such as telephones, remote controls, battery doors, keyboards, mice, game controllers, cameras, laptops, inductive power supplies, and essentially any other electronic equipment. The composite metal surface can also be integrated into non-electrically conductive heat sinks, high permeability shielding, and polished metal non-electrically conductive surfaces.

Abstract: A pressure vessel having an outer shell and a flexible inner liner. The outer shell and inner liner are configured so that the water passing through the water treatment system engages the inner liner, and not the outer shell. The inner liner is blow molded from a material that does not leach undesirable substances into the water flowing through the water treatment systems. The inner liner may include a receptacle portion to house one or more water treatment components. The receptacle portion may be flexible under the anticipated range of internal pressures. The receptacle portion may be disposed in the outer shell with the outer shell concealing expansion/contraction of the inner liner and providing the pressure vessel dimensional stability. The inner liner may include a rigid neck portion mounted to the outer shell. The outer shell and/or inner liner may include internal ribs configured to maintain spacing therebetween.

Abstract: A composite metal surface that looks metallic, but permits effective transmission of an electromagnetic field. The composite metal surface can be integrated into various electronic equipment, such as telephones, remote controls, battery doors, keyboards, mice, game controllers, cameras, laptops, inductive power supplies, and essentially any other electronic equipment. The composite metal surface can also be integrated into non-electrically conductive heat sinks, high permeability shielding, and polished metal non-electrically conductive surfaces.

Abstract: A heat sink for distributing a thermal load is disclosed that includes a base receiving the thermal load, the base having a front surface, a back surface, an inner surface, and an outer surface, the outer surface shaped generally as a cylinder and having a flat mounting region, and the inner surface shaped as a cylinder so as to define a cylindrical receiving space, a cylindrical thermal transport connected to the inner surface of the base so as to distribute the thermal load along the inner surface of the base, and heat-dissipating fins connected to the cylindrical thermal transport and extending from the cylindrical thermal transport towards a central axis of the cylindrical receiving space.

Abstract: A heat sink for dissipating a thermal load is disclosed that includes one or more heat sink bases configured around a central axis of the heat sink so as to define an interior space, at least one heat sink base receiving the thermal load, a thermal transport connected to the at least one heat sink base receiving the thermal load so as to distribute the thermal load in the heat sink, and heat-dissipating fins connected to each heat sink base, the heat-dissipating fins extending from each heat sink base into the interior space of the heat sink, each heat-dissipating fin shaped according to the location of the heat-dissipating fin with respect to the location of the thermal load and the location of the distributed thermal load in the heat sink.

Abstract: A method, apparatus and system are disclosed for a Peripheral Component Interconnect (“PCI”) Express connection device that supports use of device bus widths different than the size of the connector in communication of data processing, addressing and/or control signals between electronic and/or computer devices. Specifically, a PCI Express connector is disclosed that allows installation of a PCI Express adapter having a larger bus width than that of the connector itself, by including an opening (or “notch”) in at least one end of the connector to physically accommodate the larger dimension(s) of the adapter.

Abstract: A heat sink for distributing a thermal load is disclosed that includes two or more base plates connected and oriented around a central axis of the heat sink, at least one base plate receiving the thermal load, each base plate having thermal transport paths, the thermal transport paths oriented among the base plates so as to have the capability of accepting thermal transports having a plurality of lengths for thermal distribution between at least two base plates, heat-dissipating fins connected to each base plate, the heat-dissipating fins spaced apart in parallel and extending from each base plate towards the central axis of the heat sink, and a thermal transport connected between the base plate receiving the thermal load and at least one other base plate so as to distribute the thermal load among the base plates of the heat sink.

Abstract: A heat sink for distributing a thermal load is disclosed that includes a bottom plate, a top plate, a right plate, and a left plate, the plates connected along edges so as to define a space generally cubical in shape with four closed sides and two open ends; heat-dissipating fins connected to each plate, the fins spaced apart in parallel and extending from each plate towards a central axis of the heat sink; and a thermal transport connected to the plate receiving the thermal load and to at least one of the other plates so as to distribute the thermal load among the plates of the heat sink.

Abstract: An apparatus, system, and method are disclosed for accessing system information. The apparatus includes an observation module, a monitoring module, and an action module. The observation module receives input device signals. The monitoring module recognizes selected inputs from among input data. The action module, working independently of the local system, selectively or automatically causes system information or action to be conveyed to a user.

Abstract: A heatpipe for cooling an integrated circuit. The heatpipe includes a pipe and radial fins that are formed by extruding a single piece of material, such as heat conducting metal. Each of the radial fins extends away from the pipe and runs (preferably) the length of the pipe. Each radial fin has normally oriented subfins that provide additional heat convection surface areas to the radial fins. Within the pipe are interior fins, also formed during the material extrusion process. The interior fins provide additional conduction cooling to a heat transferring fluid circulating within the pipe.

Abstract: An apparatus, system and method for cooling vertically stacked printed circuit boards (PCBs). In one embodiment, a first PCB is disposed within a substantially enclosed lower chamber inside a PCB containment housing. A second PCB is disposed above the first PCB within the housing to define a substantially enclosed upper chamber above the lower chamber. The second PCB includes one or more airflow apertures defined therethrough and providing vertical air flow coupling between the upper and lower chambers. An airflow actuating device is utilized to generate a primary forced airflow within the upper chamber which is substantially parallel to the surface plane of the second PCB. The primary forced airflow further induces a negative air pressure in the upper chamber such that a mixed convection airflow is established between the upper and lower chambers via the second PCB apertures.

Abstract: A heatpipe for cooling an integrated circuit. The heatpipe includes a pipe and radial fins that are formed by extruding a single piece of material, such as heat conducting metal. Each of the radial fins extends away from the pipe and runs (preferably) the length of the pipe. Each radial fin has normally oriented subfins that provide additional heat convection surface areas to the radial fins. Within the pipe are interior fins, also formed during the material extrusion process.

Abstract: A dual display mode portable computer is disclosed. The portable computer includes a flat-panel display, and a display controller for outputting an internal video signal to the flat panel display. The portable computer further includes means for receiving an external video signal, and a multiplexer for outputting the internal video signal to the flat-panel display during a first display mode, and for outputting the external video signal to the flat-panel display during a second display mode, thereby enabling the portable computer to act as a display device for an external computer.

Abstract: A dual display mode portable computer is disclosed. The portable computer includes a flat-panel display, and a display controller for outputting an internal video signal to the flat panel display. The portable computer further includes means for receiving an external video signal, and a multiplexer for outputting the internal video signal to the flat-panel display during a first display mode, and for outputting the external video signal to the flat-panel display during a second display mode, thereby enabling the portable computer to act as a display device for an external computer.

Abstract: A computer having a riser card with a riser card interface that connects to an industry standard system board and has slots for expansion cards is provided with support circuitry that enables the computer system to perform personalized functions not provided for by the industry standard system board, including security functions. The placing of the support circuitry on the riser card allows the use of an industry standard system board and the personalization of the system to perform different IBM PS/2 functions depending on the installed riser card, in conjunction with Micro Channel and PCI bus architecture.