Patents by Inventor Robert Yancey

Robert Yancey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8667290
    Abstract: The system relates to a method for collecting signatures from pre-validated signers. In one aspect of the method, a pre-validated signer's signature is affixed to an electronic document in an appropriate location after the pre-validated signer authorizes the use of his or her signature.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: March 4, 2014
    Inventors: Joel Appelbaum, Robert Yancey
  • Publication number: 20130185565
    Abstract: The system relates to a method for collecting signatures from pre-validated signers. In one aspect of the method, a pre-validated signer's signature is affixed to an electronic document in an appropriate location after the pre-validated signer authorizes the use of his or her signature.
    Type: Application
    Filed: July 27, 2012
    Publication date: July 18, 2013
    Inventors: Joel Appelbaum, Robert Yancey
  • Publication number: 20050182303
    Abstract: The present invention provides systems and methods for improving the administration and usage of antibiotic/antimicrobial regimens. The method and system of the invention includes (a) establishing a multidisciplinary antimicrobial treatment team; (b) obtaining patient data; (c) reviewing patient data for sub-optimal antibiotic regimens and when necessary, conferring if MATT members regarding regimen recommendations; (d) generating reports with recommendations for optimal antibiotic regimens based on the review of the patient data.
    Type: Application
    Filed: January 6, 2005
    Publication date: August 18, 2005
    Inventor: Robert Yancey
  • Patent number: 5632667
    Abstract: A silicon wafer grinding apparatus for grinding a backside surface of a semiconductor wafer that includes integrated circuit chips patterned on a frontside surface of the wafer. The apparatus includes a plurality of chuck tables that secure a plurality of wafers to be ground. Each chuck table includes a cushioned rubber pad secured to the table and an interface with the frontside surface of the wafer. An organic acid cooling fluid is utilized during the grinding procedure to prevent silicon particles and residue from being adhered to the metal bond pads of the integrated circuit chips.
    Type: Grant
    Filed: June 29, 1995
    Date of Patent: May 27, 1997
    Assignee: Delco Electronics Corporation
    Inventors: Michael R. Earl, Russell A. Detterich, Robert A. Yancey
  • Patent number: 4083365
    Abstract: An electroencephalograph (EEG) is connected to record the brain wave response of a subject to periodic stimuli. An EEG analyzer comprising a dual integrator circuit separately records positive and negative wave responses to the stimuli during predetermined intervals and combines the recorded responses in a composite analysis of the subject's response to the periodic stimuli.
    Type: Grant
    Filed: June 10, 1976
    Date of Patent: April 11, 1978
    Inventor: Don Robert Yancey