Patents by Inventor Robert Yinan Cao

Robert Yinan Cao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanical architecture for a multi-chip module
    Patent number: 11973004
    Abstract: Described is a multi-chip module that may include a Redistribution Layer (RDL) substrate having Integrated Circuit (IC) dies mounted to a first surface of the RDL substrate. A second plurality of IC dies may be mounted to an opposite second surface. A plurality of sockets can be mounted upon the second plurality of IC dies and a cold plate then mounted to the first plurality of IC dies. The mounting structure may include socket frames coupled to the plurality of sockets.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: April 30, 2024
    Assignee: Tesla, Inc.
    Inventors: Robert Yinan Cao, Mitchell Heschke, Mengzhi Pang, Shishuang Sun, Vijaykumar Krithivasan
  • MECHANICAL ARCHITECTURE FOR A MULTI-CHIP MODULE
    Publication number: 20210351104
    Abstract: Described is a multi-chip module that may include a Redistribution Layer (RDL) substrate having Integrated Circuit (IC) dies mounted to a first surface of the RDL substrate. A second plurality of IC dies may be mounted to an opposite second surface. A plurality of sockets can be mounted upon the second plurality of IC dies and a cold plate then mounted to the first plurality of IC dies. The mounting structure may include socket frames coupled to the plurality of sockets.
    Type: Application
    Filed: September 19, 2019
    Publication date: November 11, 2021
    Inventors: Robert Yinan Cao, Mitchell Heschke, Mengzhi Pang, Shishuang Sun, Vijaykumar Krithivasan