Patents by Inventor Robert Zappulla

Robert Zappulla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5493165
    Abstract: This disclosure describes a method for producing high-performance layered-element electrostrictive or piezoelectric actuators, and the resulting product. The process calls for steps that minimize decreases of the stack stiffness which usually characterize layered wafer actuators. These include making the wafers flat and parallel, using a referred wafer metalization process that does not affect wafer surface roughness, and using stock-bonding epoxies with viscosities which readily permit the bonding agent to "wick" into the interface areas of the wafer/electrode stacks thereby to minimize the bond agent thickness.
    Type: Grant
    Filed: November 4, 1994
    Date of Patent: February 20, 1996
    Assignee: AT&T Corp.
    Inventors: Thomas E. Smith, Robert Zappulla, George G. Zipfel, Jr.
  • Patent number: 4613955
    Abstract: Wide temperature range magnetic bubble memories are realized by using new compositions of rare earth garnets which require nonlinear bias field for operation over a given temperature range. The bias field structure for providing the corresponding nonlinear bias field includes plates of barium ferrite plus additional plates of Ni-Cu alloys and/or polycrystalline dysprosium (or other rare earths, singly or in combination) iron garnet to provide a nonlinear bias field versus temperature characteristic to match that of the bubble layer.
    Type: Grant
    Filed: September 23, 1983
    Date of Patent: September 23, 1986
    Assignee: AT&T Bell Laboratories
    Inventors: Richard C. Sherwood, William J. Tabor, Eva M. Vogel, Robert Zappulla