Abstract: Various implementations disclosed herein include devices, systems, and methods that enable an autonomous vehicle to deliver items to moving vessels via an aerial payload catch arm structure removably attached to universal structures of a marine vessel. For example, a structure may include a first elongated structure pivotably attached to a second elongated structure. The second elongated structure includes an attachment structure configured to removably attach the second elongated structure to a structure on a vessel. The structure may further include a third elongated structure pivotably attached to the first elongated structure and a platform structure comprising a porous platform. The platform structure is attached to the third elongated structure such that the platform structure in combination with the third elongated member and the first elongated member is configured to rotate around the second elongated member to move the platform structure between positions for an autonomous vehicle delivery.

Abstract: The invention relates to configurable radio frequency, RF, system. The RF system comprises: a first RF module which comprises a signal path and an RF port; wherein the RF port is arranged for being connected to a further RF module or to a device-under-test, DUT; wherein the first RF module further comprises at least a first and a second auxiliary port which are accessible from outside the first RF module; wherein the first and the second auxiliary port are arranged for being connected to each other via: a first bridging element or a first extension module of the configurable RF system; and wherein the signal path is connected to the RF port and passes through: the first auxiliary port, the first bridging element or the first extension module, and the second auxiliary port.

Abstract: A riser extending from a floating rig has a riser manifold. A rig manifold can be manipulated by an arm to couple in an automated manner to the riser manifold when running the riser from the rig. The riser and rig manifolds have mechanical connectors that mechanically connect them. Additionally, the manifolds have flow couplings mating together for conducting flow in at least one flow connection, and the manifolds control couplings mating together for conducting control in at least one flow connection. At least one of the manifolds has at least one valve controllable with the at least one control connection and configured to control fluid communication for the at least one flow connection between at least one rig flow line and an internal passage of the riser.

Abstract: A flat no-leads package, the flat no-leads package includes a leadframe for electrically connecting an integrated circuit (IC) chip which in a mounted configuration is arranged in a center portion of the flat no-leads package. The leadframe has at least one RF lead pin; and an isolating encapsulation which is at least partially encapsulating the leadframe such that contact surfaces of the leadframe are electrically contactable at least from a bottom side of the flat no-leads package; wherein at least one of the RF lead pin has a first and second contact surfaces. A cross-section of the RF lead pin increases from the first contact surface to the second contact surface both in a horizontal direction and in a direction vertical thereto. Further, a printed circuit board having a flat no-leads package and a measurement device having a flat no-leads package are provided.

Abstract: A riser extending from a floating rig includes one or more flow control devices having at least one flow connection and having at least one control connection. A riser manifold is disposed on the riser above the one or more flow control devices and has a first mechanical connector, a first flow coupling, and a first control coupling. A rig manifold can be manipulated by an arm to couple in an automated manner to the riser manifold when running the riser from the rig. The rig manifold has a second mechanical connector that mechanically connects to the first mechanical connector of the riser manifold. Additionally, the rig manifold has a second flow coupling mating with the first flow coupling of the riser manifold for conducting flow, and has a second control coupling mating with the first control coupling of the riser manifold for conducting control.

Abstract: A flat no-leads package, the flat no-leads package includes a leadframe for electrically connecting an integrated circuit (IC) chip which in a mounted configuration is arranged in a center portion of the flat no-leads package, The leadframe has at least one RF lead pin; and an isolating encapsulation which is at least partially encapsulating the leadframe such that contact surfaces of the leadframe are electrically contactable at least from a bottom side of the flat no-leads package; wherein at least one of the RF lead pin has a first and second contact surfaces. A cross-section of the RF lead pin increases from the first contact surface to the second contact surface both in a horizontal direction and in a direction vertical thereto. Further, a printed circuit board having a flat no-leads package and a measurement device having a flat no-leads package are provided.

Abstract: An on-wafer calibration device comprises on a substrate at least a first measuring port, at least a first switch element, at least two calibration standards, and a controller unit or a control interface for control of the first switch element. The first switch element is controlled in a manner that it selectively connects a wafer probe tip connectable to the first measuring port to the at least two calibration standards.

Abstract: A riser extending from a floating rig includes one or more flow control devices having at least one flow connection and having at least one control connection. A riser manifold is disposed on the riser above the one or more flow control devices and has a first mechanical connector, a first flow coupling, and a first control coupling. A rig manifold can be manipulated by an arm to couple in an automated manner to the riser manifold when running the riser from the rig. The rig manifold has a second mechanical connector that mechanically connects to the first mechanical connector of the riser manifold. Additionally, the rig manifold has a second flow coupling mating with the first flow coupling of the riser manifold for conducting flow, and has a second control coupling mating with the first control coupling of the riser manifold for conducting control.

Abstract: A riser extending from a floating rig has a riser manifold. A rig manifold can be manipulated by an arm to couple in an automated manner to the riser manifold when running the riser from the rig. The riser and rig manifolds have mechanical connectors that mechanically connect them. Additionally, the manifolds have flow couplings mating together for conducting flow in at least one flow connection, and the manifolds control couplings mating together for conducting control in at least one flow connection. At least one of the manifolds has at least one valve controllable with the at least one control connection and configured to control fluid communication for the at least one flow connection between at least one rig flow line and an internal passage of the riser.

Abstract: An on-wafer calibration device comprises on a substrate at least a first measuring port, at least a first switch element, at least two calibration standards, and a controller unit or a control interface for control of the first switch element. The first switch element is controlled in a manner that it selectively connects a wafer probe tip connectable to the first measuring port to the at least two calibration standards.

Abstract: A specimen container for urine and other liquids is provided having a container lid, an elastomeric septum, a cup, and a non-porous seal. The elastomeric septum covers a septum hole in the lid, and the non-porous seal is affixed to the lid such that it creates a liquid-tight boundary between the septum and the chamber within the bottle. The septum includes a depressed portion and an area of minimum thickness shaped to allow an implement to pass through the area of minimum thickness. The depressed portion may also include a pre-cut which allows the implement to pass through the septum more easily.

Abstract: A specimen container for urine and other liquids is provided having a container lid, an elastomeric septum, a cup, and a non-porous seal. The elastomeric septum covers a septum hole in the lid, and the non-porous seal is affixed to the lid such that it creates a liquid-tight boundary between the septum and the chamber within the bottle. The septum includes a depressed portion and an area of minimum thickness shaped to allow an implement to pass through the area of minimum thickness. The depressed portion may also include a pre-cut which allows the implement to pass through the septum more easily.

Abstract: The circuit arrangement according to the invention provides a substrate (10), a connecting element (18) and a chip (16). The substrate (10) provides at least a partial metallisation (11) on its surface. The connecting element (18) is applied to the metallisation (11). The chip (16) is applied to the connecting element (18). The connecting element (18) provides an electrically non-conductive glass layer (14), which is applied directly to the metallisation (11), and an adhesive layer (15) between the chip (16) and the glass layer (14).

Abstract: An electrical circuit arrangement provides a substrate and at least two conductive surfaces. The substrate comprises at least one layer disposed between the conductive surfaces. The conductive surfaces form a capacitor and overlap in part and form an overlapping area. In the event of a displacement of the conductive surfaces relative to one another, the resulting overlapping area is largely constant up to a threshold value of the displacement.

Abstract: An electrical circuit arrangement provides a substrate and at least two conductive surfaces. The substrate comprises at least one layer disposed between the conductive surfaces. The conductive surfaces form a capacitor and overlap in part and form an overlapping area. In the event of a displacement of the conductive surfaces relative to one another, the resulting overlapping area is largely constant up to a threshold value of the displacement.

Abstract: The circuit arrangement according to the invention provides a substrate (10), a connecting element (18) and a chip (16). The substrate (10) provides at least a partial metallisation (11) on its surface. The connecting element (18) is applied to the metallisation (11). The chip (16) is applied to the connecting element (18). The connecting element (18) provides an electrically non-conductive glass layer (14), which is applied directly to the metallisation (11), and an adhesive layer (15) between the chip (16) and the glass layer (14).

Abstract: An electrical circuit arrangement provides a substrate and at least two conductive surfaces. The substrate comprises at least one layer disposed between the conductive surfaces. The conductive surfaces form a capacitor and overlap in part and form an overlapping area. In the event of a displacement of the conductive surfaces relative to one another, the resulting overlapping area is largely constant up to a threshold value of the displacement.