Abstract: A self-service kiosk is disclosed. The self-service kiosk may have a housing, including a user interface. The user interface may receive from a user a selection of an item. The user interface may also receive from the user a payment for a purchase of the item. The self-service kiosk may include a fabrication system disposed within the housing. The fabrication system may fabricate the item selected by the user. The self-service kiosk may also include a packaging system. The packaging system may sealingly enclose the item in a package. Further, the self-service kiosk may include a bin that may dispense the package, including the item, to the user.

Abstract: A self-service kiosk is disclosed. The self-service kiosk may have a housing, including a user interface. The user interface may receive from a user a selection of an item. The user interface may also receive from the user a payment for a purchase of the item. The self-service kiosk may include a fabrication system disposed within the housing. The fabrication system may fabricate the item selected by the user. The self-service kiosk may also include a packaging system. The packaging system may sealingly enclose the item in a package. Further, the self-service kiosk may include a bin that may dispense the package, including the item, to the user.

Abstract: A self-service kiosk is disclosed. The self-service kiosk may have a housing, including a user interface. The user interface may receive from a user a selection of an item. The user interface may also receive from the user a payment for a purchase of the item. The self-service kiosk may include a fabrication system disposed within the housing. The fabrication system may fabricate the item selected by the user. The self-service kiosk may also include a packaging system. The packaging system may sealingly enclose the item in a package. Further, the self-service kiosk may include a bin that may dispense the package, including the item, to the user.

Abstract: Robots, robot systems, and methods may interact with users. Data from a sensor may be received by a processor associated with a robot. The processor may determine a user input based on the data from the sensor. The processor may send the user input to a remote service via a communication device. The processor may receive command data from the remote service via the communication device. The processor may cause an expressive element to perform an action corresponding to the command data.

Abstract: Methods and apparatus for simulating the sound of a specific percussion instrument. A first stored waveform representative of the impulse response of the specific percussion instrument is convolved with a second waveform representating of the vibrations produced when a playing surface is struck, scraped or rubbed by a hand-held implement manipulated by a human player. A control interface produces a control signal indicative of a desired audio effect, and a signal processor modifies the spectral components of the output waveform produced by the convolution in response to the control signal to produce a modified output waveform that manifests the desired audio effect.

Abstract: Methods and apparatus for simulating the sound of an acoustic percussion instrument. A first stored waveform signal representative of the impulse response of an acoustic percussion instrument is convolved with a waveform produced by a sensor circuit attached to a physical playing surface. Undesirable response characteristics of the playing surface and sensor circuit may be filtered out by deconvolving sensor output, or the stored waveform representing the acoustic instrument, with the impulse response of the combination of the playing surface and the sensor circuit.

Abstract: A multichip semiconductor structure and fabrication method having connect assemblies with fuses which facilitate burn-in stressing and electrical testing of the structure are presented. The structure comprises a multichip stack having standard transfer wire outs to an edge surface thereof. At least some wire outs to the edge surface have fuses electrically series connected thereto such that should an excessive current source/sink arise during burn-in stressing, the corresponding fuse will open circuit. A conductive structure is also disclosed that facilitates the formation of final, operational metallization wiring on the edge surface of the multichip structure prior to burn-in stressing and testing. This conductive structure includes a first conductive level and a second conductive level. The first conductive level has isolated conductors with ends disposed in close proximity.

Abstract: A multichip semiconductor structure and fabrication method having connect assemblies with fuses which facilitate burn-in stressing and electrical testing of the structure are presented. The structure comprises a multichip stack having standard transfer wire outs to an edge surface thereof. At least some wire outs to the edge surface have fuses electrically series connected thereto such that should an excessive current source/sink arise during burn-in stressing, the corresponding fuse will open circuit. A conductive structure is also disclosed that facilitates the formation of final, operational metallization wiring on the edge surface of the multichip structure prior to burn-in stressing and testing. This conductive structure includes a first conductive level and a second conductive level. The first conductive level has isolated conductors with ends disposed in close proximity.