Abstract: The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.

Abstract: The application describes a moulded interposer member for a MEMS transducer package. The interposer member comprises a void region and at least one through hole or channel.

Abstract: The application describes a package substrate for a MEMS transducer package having a recessed region formed in an upper surface of the package substrate. The recessed region extends only partially through the package substrate from an opening in the upper surface of the package substrate in a first direction towards the lower surface of the substrate. The recessed region extends only partially though the package substrate from an opening in a side surface of the package substrate in a second direction towards an opposite side surface.

Abstract: The application relates to structures, e.g. substrates for supporting semiconductor die. The substrate defines a frame which lateral surrounds one or more die and is provided in contact with at least one side surface of the die, wherein the frame defines upper and lower surfaces of the substrate.

Abstract: The application relates to a MEMS transducer package comprising: a package substrate the package substrate comprising a substrate channel, the substrate channel comprising first and second channel portions, wherein the first portion extends in a first direction between a first channel opening in a side surface of the substrate and a junction between the first and second channel portions, and wherein the second portion extends in a second direction between said junction and a second channel opening at, or underlying, a substrate opening provided in an upper surface of the package substrate.

Abstract: The present application describes a MEMS transducer package having a substrate layer which defines a recess. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate.

Abstract: The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.

Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.

Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.

Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

Abstract: A device (1) is described for stopping, releasing and restoring the position of roller-type window nets (3, 48), comprising: a fixing shaft (13) having a coupling groove (15) formed in a front external circumferential surface thereof and an insertion groove (16) formed in a rear surface thereof; a ball rotor (18) inserted into the fixing shaft (13) and coupled to the external circumferential surface of the fixing shaft (13), including a front portion coupled by means of a spring (30) and having a conveying groove (20) formed in a surface thereof for conveying a ball (40) and a guide jaw (38) formed in a central part thereof, wherein the ball (40) is inserted into the conveying groove (20); and an outer rotor (42) coupled to the conveying groove (20) via the ball (40) and having a rotation groove (44) formed in an internal circumferential surface thereof, wherein the ball (40) is coupled to the rotation groove (44) to rotate.

Abstract: A load-sensing device is arranged in a package forming a chamber. The package has a deformable substrate configured, in use, to be deformed by an external force. A sensor unit is positioned in direct contact with the deformable substrate and is configured to detect deformations of the deformable substrate. An elastic element within of the chamber is arranged to act between the package and the sensor unit to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. The deformable substrate may be a base of the package, and the elastic element may be a metal lamina arranged between the lid of the package and the sensor unit. The sensor unit may be a semiconductor die integrating piezoresistors.

Abstract: The mirror group is formed by a monolithic frame bent along a bending line and including a first and a second supporting portions carrying, respectively, a first and a second chips forming two micromirrors made using MEMS technology. The first and second supporting portions are arranged on opposite sides of the bending line of the frame, angularly inclined with respect to each other. The mirror group is obtained by separating a shaped metal tape carrying a plurality of frames, having flexible electric connection elements. After attaching the chips, the frames are precut, bent along the bending line, and separated.

Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.

Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

Abstract: The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.

Abstract: An improved cooling system is described, comprising: a containing case (3); a filter and fan assembly (1), inserted in a wall of the containing case (3); a filter (2) inserted in a wall of the containing case (3) and equipped with a protecting grid placed inside the case (3); a sensitive thermal-resistive element (11) applied onto the grid of every filter (2); and a control unit (10) connected to the sensitive element (11); wherein the sensitive element (11) has a thermal capability such that, with a power, and therefore a current, lower than 100 mW, a self-heating effect is obtained in unmoving air.

Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.