Abstract: The MEMS actuator is formed by a substrate, which surrounds a cavity; by a deformable structure suspended on the cavity; by an actuation structure formed by a first piezoelectric region of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure formed by a second piezoelectric region of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.

Abstract: A microelectromechanical (MEMS) structure includes a fixed frame internally defining a cavity, and a mobile mass suspended in the cavity and movable with a first resonant rotational mode about a first rotation axis and with a second resonant rotational mode about a second rotation axis orthogonal to the first. A pair of supporting elements extends in the cavity, is rigidly coupled to the fixed frame, and is elastically deformable to cause rotation of the mobile mass about the first rotation axis. A pair of elastic-coupling elements is elastically coupled between the mobile mass and the first pair of supporting elements. Each of the elastic-coupling elements includes a first and second elastic portions, the first elastic portion being compliant to torsion about the second rotation axis. The second elastic portion is compliant to bending outside of a horizontal plane of main extension of the MEMS structure.

Abstract: A microelectromechanical structure includes a body of semiconductor material having a fixed frame internally defining a cavity, a mobile mass elastically suspended in the cavity and movable with a first resonant movement about a first rotation axis and with a second resonant movement about a second rotation axis, orthogonal to the first axis. First and second pairs of supporting elements, extending in cantilever fashion in the cavity, are rigidly coupled to the frame, and are piezoelectrically deformable to cause rotation of the mobile mass about the first and second rotation axes. First and second pairs of elastic-coupling elements are elastically coupled between the mobile mass and the first and the second pairs of supporting elements. The first and second movements of rotation of the mobile mass are decoupled from one another and do not interfere with one another due to the elastic-coupling elements of the first and second pairs.

Abstract: A MEMS actuator includes a mobile mass suspended over a substrate in a first direction and extending in a plane that defines a second direction and a third direction perpendicular thereto. Elastic elements arranged between the substrate and the mobile mass have a first compliance in a direction parallel to the first direction that is lower than a second compliance in a direction parallel to the second direction. Piezoelectric actuation structures have a portion fixed with respect to the substrate and a portion that deforms in the first direction in response to an actuation voltage. Movement-transformation structures coupled to the piezoelectric actuation structures include an elastic movement-conversion structure arranged between the piezoelectric actuation structures and the mobile mass. The elastic movement-conversion structure is compliant in a plane formed by the first and second directions and has first and second principal axes of inertia transverse to the first and second directions.

Abstract: A microelectromechanical mirror device has, in a die of semiconductor material: a fixed structure defining a cavity; a tiltable structure carrying a reflecting region elastically suspended above the cavity; at least a first pair of driving arms coupled to the tiltable structure and carrying respective piezoelectric material regions which may be biased to cause a rotation thereof around at least one rotation axis; elastic suspension elements coupling the tiltable structure elastically to the fixed structure and which are stiff with respect to movements out of the horizontal plane and yielding with respect to torsion; and a piezoresistive sensor configured to provide a detection signal indicative of the rotation of the tiltable structure. At least one test structure is integrated in the die to provide a calibration signal indicative of a sensitivity variation of the piezoresistive sensor in order to calibrate the detection signal.

Abstract: A process for manufacturing a microelectromechanical mirror device includes, in a semiconductor wafer, defining a support frame, a plate connected to the support frame so as to be orientable around at least one rotation axis, and cantilever structures extending from the support frame and coupled to the plate so that bending of the cantilever structures causes rotations of the plate around the at least one rotation axis. The process further includes forming piezoelectric actuators on the cantilever structures, forming pads on the support frame, and forming spacer structures protruding from the support frame more than both the pads and the stacks of layers forming the piezoelectric actuators.

Abstract: A microelectromechanical mirror device includes a fixed structure defining a cavity, a tiltable structure elastically suspended above the cavity and carrying a reflecting surface, and having a main extension in a horizontal plane. A first pair of driving arms carry respective piezoelectric material regions that are biased to cause a rotation of the tiltable structure around a first rotation axis parallel to a first horizontal axis of the horizontal plane, and elastically coupled to the tiltable structure. Elastic suspension elements that couple the tiltable structure to the fixed structure at the first rotation axis are stiff with respect to movements out of the horizontal plane and yielding with respect to torsion around the first rotation axis, and further extend between the tiltable structure and the fixed structure. The elastic suspension elements have an asymmetrical arrangement on opposite sides of the tiltable structure along the first rotation axis.

Abstract: A MEMS device includes a semiconductor body with a cavity and forming an anchor portion, a tiltable structure elastically suspended over the cavity, first and second support arms to support the tiltable structure, and first and second piezoelectric actuation structures biasable to deform mechanically, generating a rotation of the tiltable structure around a rotation axis. The piezoelectric actuation structures carry first and second piezoelectric displacement sensors. When the tiltable structure rotates around the rotation axis, the displacement sensors are subject to respective mechanical deformations and generate respective sensing signals in phase opposition to each other, indicative of the rotation of the tiltable structure. The sensing signals are configured to be acquired in a differential manner.

Abstract: A micromechanical device includes a fixed structure, a mobile portion rotatable about a first rotation axis, and a first actuation structure arranged between the fixed structure and the mobile portion to enable rotation of the mobile portion about the first rotation axis. The mobile portion includes a supporting structure, a tiltable platform rotatable about a second rotation axis, transverse to the first rotation axis, and a second actuation structure coupled between the tiltable platform and the supporting structure. Stiffening elements are arranged between the supporting structure and the fixed structure. The micromechanical device may be used within a pico-projector.

Abstract: A method of manufacturing an electronic module includes providing a base substrate having a first surface, providing a first supporting element having a first portion with an inclined top surface, and affixing the first supporting element to the first surface such that the inclined top surface is inclined with respect to the base substrate. A first reflector is coupled to the inclined top surface such that a rear surface of the first reflector is in physical contact with the inclined top surface of the first portion of the first supporting element, and a spacer structure is configured to form an interface for mounting lateral walls to the base substrate. A cap is positioned over and supported by the lateral walls to thereby define a chamber. The emitter, as well as a detector, are coupled to the first surface of the base substrate.

Abstract: Disclosed herein is a method of making a microelectromechanical (MEMS) device. The method includes, in a single structural layer, affixing a tiltable structure to an anchorage portion with first and second supporting arms extending between the anchorage portion and opposite sides of the tiltable structure, and forming first and second resonant piezoelectric actuation structures extending between a constraint portion of the first supporting arm and the anchorage portion, on opposite sides of the first supporting arm. The method further includes coupling a handling wafer underneath the structural layer to define a cavity therebetween, and forming a passivation layer over the structural layer, the passivation layer having contact openings defined therein for routing metal regions for electrical coupling to respective electrical contact pads, the electrical contact pads being electrically connected to the first and second resonant piezoelectric actuation structures.

Abstract: A substrate and a covering structure coupled to the substrate form a chamber. The chamber houses an emitter configured to emit a radiation, a resonant reflector, a detector, and a fixed reflector. First and second windows extend through the covering structure. The emitter, the first reflector and the second reflector are reciprocally arranged such that radiation emitted from the emitter is reflected by the fixed reflector towards the MEMS reflector for further reflection towards the first window to form an output signal. The detector and the second window are reciprocally arranged such that an incoming radiation passing through the second window is received by the detector. The electronic module can be used for a 3D sensing application.

Abstract: Disclosed herein is an optical module including a substrate, with an optical detector, laser emitter, and support structure being carried by the substrate. An optical layer includes a fixed portion carried by the support structure, a movable portion affixed between opposite sides of the fixed portion by a spring structure, and a lens system carried by the movable portion. The movable portion has at least one opening defined therein across which the lens system extends, with at least one supporting portion extending across the at least one opening to support the lens system. The optical layer further includes a MEMS actuator for in-plane movement of the movable portion with respect to the fixed portion.

Abstract: An optical module includes an optical detector, laser emitter, and first and second support structures, each carried by a substrate. An optical layer includes first and second fixed portions carried by the support structures, a movable portion affixed between the fixed portions by a spring structure, and a lens system carried by the movable portion, the lens system including an objective lens and a beam shaping lens. The optical layer includes a comb drive with a first comb structure extending from the first fixed portion to interdigitate with a second comb structure extending from the movable portion, a third comb structure extending from the second fixed portion to interdigitate with a fourth comb structure extending from the movable portion, and actuation circuitry applying voltages to the comb structures to cause the movable portion of the optical layer to oscillate back and forth between the fixed portions.

Abstract: A microelectromechanical mirror device has a fixed structure defining a cavity. A tiltable structure carrying a reflecting surface is elastically suspended above the cavity with a main extension in a horizontal plane. Elastic elements are coupled to the tiltable structure and at least one first pair of driving arms, which carry respective regions of piezoelectric material, are biasable to cause rotation of the tiltable structure about at least one first axis of rotation parallel to a first horizontal axis of the horizontal plane. The driving arms are elastically coupled to the tiltable structure on opposite sides of the first axis of rotation and are interposed between the tiltable structure and the fixed structure. The driving arms have a thickness, along an orthogonal axis transverse to the horizontal plane, smaller than a thickness of at least some of the elastic elements coupled to the tiltable structure.

Abstract: A MEMS device is formed in a die of semiconductor material having a cavity defined therein and having an anchorage portion. A tiltable structure is elastically suspended over the cavity and has a main extension in a horizontal plane. First and second supporting arms extend between the anchorage portion and opposite sides of the tiltable structure. First and second resonant piezoelectric actuation structures are intended to be biased to thereby cause rotation of the tiltable structure about a rotation axis. The first supporting arm is formed by first and second torsion springs, which are rigid to movements out of the horizontal plane and compliant to torsion about the rotation axis and are coupled together at a constraint region. The first and second resonant piezoelectric actuation structures extend between the anchorage portion and the constraint structure, on first and second sides of the first supporting arm.

Abstract: A MEMS device is formed by a body of semiconductor material which defines a support structure. A pass-through cavity in the body is surrounded by the support structure. A movable structure is suspended in the pass-through cavity. An elastic structure extends in the pass-through cavity between the support structure and the movable structure. The elastic structure has a first and second portions and is subject, in use, to mechanical stress. The MEMS device is further formed by a metal region, which extends on the first portion of the elastic structure, and by a buried cavity in the elastic structure. The buried cavity extends between the first and the second portions of the elastic structure.

Abstract: A MEMS micromirror device includes a monolithic body of semiconductor material having a first main surface and a second main surface, with the monolithic body having an opening extending from the second main surface and including a suspended membrane of monocrystalline semiconductor material extending between the opening and the first main surface of the monolithic body. The suspended membrane includes a supporting frame and a mobile mass carried by the supporting frame and rotatable about an axis parallel to the first main surface, with the mobile mass having a width less than a width of the opening. A reflecting region extends over the mobile mass.

Abstract: A microelectromechanical device includes a fixed structure having a frame defining a cavity, a tiltable structure elastically suspended above the cavity with main extension in a horizontal plane, a piezoelectrically driven actuation structure which can be biased to cause a desired rotation of the tiltable structure about a first and second rotation axes, and a supporting structure integral with the fixed structure and extending in the cavity starting from the frame. Lever elements are elastically coupled to the tiltable structure at a first end by elastic suspension elements and to the supporting structure at a second end by elastic connecting elements which define a lever rotation axis. The lever elements are elastically coupled to the actuation structure so that their biasing causes the desired rotation of the tiltable structure about the first and second rotation axes.

Abstract: A microelectromechanical mirror device includes a supporting frame of semiconductor material and a plate of semiconductor material. The plate is connected to the supporting frame so as to be orientable around at least one rotation axis. A reflective layer is arranged on a first region of the plate. A piezoelectric actuation structure extends on a second region of the plate adjacent to the reflective layer. The piezoelectric actuation structure is configured to apply forces such as to modify a curvature of the plate.