Patents by Inventor Roberto Galeotti
Roberto Galeotti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230420405Abstract: In some implementations, an electro-optical device includes a first substrate including a first ground pad and a first signal pad; a second substrate including a second ground pad and a second signal pad, wherein the first signal pad and the second signal pad form a signal pad pair, wherein the first substrate is separated from the second substrate by less than a threshold amount; wherein the first substrate is configured to receive an optical component and the second substrate is configured to receive an electrical component that is couplable to the optical component via a wire bonding between the first signal pad and the second signal pad; and a planar ribbon bonding connecting the first ground pad to the second ground pad and diagonally crossing the wire bonding.Type: ApplicationFiled: September 30, 2022Publication date: December 28, 2023Inventors: Flavio DELL'ORTO, Roberto GALEOTTI, Luca MAURI
-
Publication number: 20230056968Abstract: In some implementations, an opto-electrical device includes a heatsink; a thermally conductive element disposed on a first region of a surface of the heatsink; an adaptive thickness thermally conductive pad disposed on the thermally conductive element; an integrated circuit (IC) disposed on the adaptive thickness thermally conductive pad; a thermoelectric cooler (TEC) disposed on a second region of the surface of the heatsink; an opto-electrical chip disposed on the TEC; and a substrate disposed on the IC and the opto-electrical chip, wherein the substrate is configured to electrically connect the IC and the opto-electrical chip.Type: ApplicationFiled: January 20, 2022Publication date: February 23, 2023Inventors: Roberto GALEOTTI, Mario BONAZZOLI, Flavio DELL'ORTO, Nicola RETTANI
-
Patent number: 10720688Abstract: An RF transition assembly (300) for enabling a radiofrequency transition between an RF transmission layer (301) of an electronic device and a conductor (309) which is electrically connected (317) to the RF transmission layer (301). The conductor (309) extends generally orthogonal to the RF transmission layer (301). The assembly comprises an open coaxial structure (313) located adjacent to an edge of the RF transmission layer (301). The open coaxial structure (313) comprises a cavity (315) extending therethrough for receiving the conductor (309). The cavity (315) comprises an opening facing the edge of the RF transmission layer (301) so as to direct electromagnetic radiation towards the RF transmission layer (301).Type: GrantFiled: April 24, 2017Date of Patent: July 21, 2020Assignee: Lumentum Technology UK LimitedInventors: Mario Bonazzoli, Roberto Galeotti, Luigi Gobbi
-
Publication number: 20190124759Abstract: An RF transition assembly (300) for enabling a radiofrequency transition between an RF transmission layer (301) of an electronic device and a conductor (309) which is electrically connected (317) to the RF transmission layer (301). The conductor (309) extends generally orthogonal to the RF transmission layer (301). The assembly comprises an open coaxial structure (313) located adjacent to an edge of the RF transmission layer (301). The open coaxial structure (313) comprises a cavity (315) extending therethrough for receiving the conductor (309). The cavity (315) comprises an opening facing the edge of the RF transmission layer (301) so as to direct electromagnetic radiation towards the RF transmission layer (301).Type: ApplicationFiled: April 24, 2017Publication date: April 25, 2019Applicant: Oclaro Technology LimitedInventors: Mario Bonazzoli, Roberto Galeotti, Luigi Gobbi
-
Patent number: 9488784Abstract: There is described an optoelectronic device having a housing and a chip housed by the housing. At least a portion of the chip protrudes through an aperture in a wall of the housing. There is further provided an optoelectronic module comprising such an optoelectronic device and electronic control circuitry adapted to control the operation of the optoelectronic device.Type: GrantFiled: February 7, 2011Date of Patent: November 8, 2016Assignee: OCLARO TECHNOLOGY LIMITEDInventors: Roberto Galeotti, Mario Bonazzoli, Nicola Rettani
-
Publication number: 20130034328Abstract: There is described an optoelectronic device having a housing and a chip housed by the housing. At least a portion of the chip protrudes through an aperture in a wall of the housing. There is further provided an optoelectronic module comprising such an optoelectronic device and electronic control circuitry adapted to control the operation of the optoelectronic device.Type: ApplicationFiled: February 7, 2011Publication date: February 7, 2013Applicant: OCLARO TECHNOLOGY LIMITEDInventors: Roberto Galeotti, Mario Bonazzolli, Nicola Rettani
-
Patent number: 8206042Abstract: A package design for electro-optic devices has been developed in which the substrate supporting the electro-optic element serves also as the base of the device housing. The electro-optic element is flip-chip bonded to the substrate. In a preferred embodiment the substrate is a multi-level wiring board.Type: GrantFiled: July 20, 2009Date of Patent: June 26, 2012Assignee: Oclaro (North America), Inc.Inventors: Roberto Galeotti, Luigi Gobbi, Mario Bonazzoli
-
Patent number: 7641400Abstract: A package design for electro-optic devices has been developed in which the substrate supporting the electro-optic element serves also as the base of the device housing. The electro-optic element is flip-chip bonded to the substrate. In a preferred embodiment the substrate is a multi-level wiring board.Type: GrantFiled: April 29, 2008Date of Patent: January 5, 2010Assignee: Oclaro Inc.Inventors: Roberto Galeotti, Luigi Gobbi, Mario Bonazzoli
-
Publication number: 20090324166Abstract: A package design for electro-optic devices has been developed in which the substrate supporting the electro-optic element serves also as the base of the device housing. The electro-optic element is flip-chip bonded to the substrate. In a preferred embodiment the substrate is a multi-level wiring board.Type: ApplicationFiled: July 20, 2009Publication date: December 31, 2009Inventors: Roberto Galeotti, Luigi Gobbi, Mario Bonazzoli
-
Publication number: 20090269021Abstract: A package design for electro-optic devices has been developed in which the substrate supporting the electro-optic element serves also as the base of the device housing. The electro-optic element is flip-chip bonded to the substrate. In a preferred embodiment the substrate is a multi-level wiring board.Type: ApplicationFiled: April 29, 2008Publication date: October 29, 2009Inventors: Roberto Galeotti, Luigi Gobbi, Mario Bonazzoli
-
Patent number: 7484900Abstract: The present invention generally relates to an air cavity plastic package for a high frequency optical device. In one aspect, a module package for a high frequency optoelectronic device is provided. The module package includes an upper plastic housing having an upper cavity formed therein and a lower plastic housing having a lower cavity formed therein. The upper housing and the lower housing are configured to mate together such that the cavities form an enclosed air cavity between the housings. Additionally, upon creating a seal between the housings, an optical feed through is realized. The module package further includes a plurality of conductors disposed in the lower housing, each conductor having an upper end and a lower end, wherein the upper end is connectable to a chip disposed in the air cavity and the lower end is connectable to a board. In another aspect, a method of packaging and assembling a high frequency optical device is provided.Type: GrantFiled: October 5, 2006Date of Patent: February 3, 2009Assignee: Avanex CorporationInventors: Roberto Galeotti, Luigi Gobbi, Mario Bonazzoli
-
Publication number: 20080085084Abstract: The present invention generally relates to an air cavity plastic package for a high frequency optical device. In one aspect, a module package for a high frequency optoelectronic device is provided. The module package includes an upper plastic housing having an upper cavity formed therein and a lower plastic housing having a lower cavity formed therein. The upper housing and the lower housing are configured to mate together such that the cavities form an enclosed air cavity between the housings. Additionally, upon creating a seal between the housings, an optical feed through is realized. The module package further includes a plurality of conductors disposed in the lower housing, each conductor having an upper end and a lower end, wherein the upper end is connectable to a chip disposed in the air cavity and the lower end is connectable to a board. In another aspect, a method of packaging and assembling a high frequency optical device is provided.Type: ApplicationFiled: October 5, 2006Publication date: April 10, 2008Inventors: Roberto Galeotti, Luigi Gobbi, Mario Bonazzoli
-
Patent number: 6712528Abstract: The invention relates to an optical assembly for opto-electronic packages comprising an optical fibre secured on the underside of an elongated support member in optical alignment with an opto-electronic device, wherein said support member is affixed to an aligning member, which in turn is affixed, e.g., by laser welding, to a welding platform. In a preferred embodiment, the elongated support member is a planar parallelepiped. In a further preferred embodiment, the elongated support member is a parallelepiped with an axially extended slot, in which the optical fibre is secured with its longitudinal axis substantially parallel to the axially extended slot.Type: GrantFiled: June 27, 2002Date of Patent: March 30, 2004Assignee: Corning O.T.I. S.r.l.Inventors: Roberto Galeotti, Mark Andrew Shaw, Giacomo Coppo
-
Publication number: 20030026557Abstract: The invention relates to an optical assembly for opto-electronic packages comprising an optical fiber secured on the underside of an elongated support member in optical alignment with an opto-electronic device, wherein said support member is affixed to an aligning member, which in turn is affixed, e.g., by laser welding, to a welding platform. In a preferred embodiment, the elongated support member is a planar parallelepiped. In a further preferred embodiment, the elongated support member is a parallelepiped with an axially extended slot, in which the optical fiber is secured with its longitudinal axis substantially parallel to the axially extended slot.Type: ApplicationFiled: June 27, 2002Publication date: February 6, 2003Inventors: Roberto Galeotti, Mark Andrew Shaw, Giacomo Coppo