Abstract: An electronic package is provided. The electronic package includes a chip carrier having a first conductive layer which includes at least one signal track and at least one contact area, the contact area being electrically connected to the signal track and adapted for transmitting a high-frequency signal. The chip carrier further includes a reference structure having at least two conductive layers such that the signal track is electrically shielded by the reference structure. A semiconductor chip is positioned on the chip carrier and includes at least one terminal electrically interconnected to the at least one contact area.

Abstract: A multi-layered circuitized substrate for high-frequency applications. Conductive via-holes extend between two non-adjacent conductive layers for transmitting high-frequency signals therebetween. For each via-hole, shielding rings connectable to a reference voltage are provided, each ring formed in a corresponding intermediate conductive layer between the two non-adjacent conductive layers. The rings define a shielding coaxial structure for the via-hole. Preferably, the intermediate conductive layers are spaced apart from the via-hole, and particularly from respective lands at the ends thereof, in order to reduce stray capacitance associated with the via-hole without losing the shielding effect provided by the rings.

Abstract: A multi-layered circuitized substrate for high-frequency applications. Conductive via-holes extend between two non-adjacent conductive layers for transmitting high-frequency signals therebetween. For each via-hole, shielding rings connectable to a reference voltage are provided, each ring formed in a corresponding intermediate conductive layer between the two non-adjacent conductive layers. The rings define a shielding coaxial structure for the via-hole. Preferably, the intermediate conductive layers are spaced apart from the via-hole, and particularly from respective lands at the ends thereof, in order to reduce stray capacitance associated with the via-hole without losing the shielding effect provided by the rings.

Abstract: The present invention relates to a duplexer set up by two decoupling filters for high frequency transceivers of the temperature self-compensating type and implemented by means of a pair of mechanic bodies (2), each one of which including a plurality of resonance cavities (3). Inside of the cavity (3) of the superior body (2) of the duplexer, a corresponding adjustment disc (7) is lodged in a removable and coaxial way which is provided with a supporting stem (8) coming out of a passage hole (12) obtained on the summit of the cavity (3). The bodies (2) are bound between them, so that the cavities of one or the other turn out to be coaxially facing each other. The passage hole (12) of the filter according to the invention is threaded. Moreover at each filter at least one bush (9) is associated having one portion (11) engaged in the hole (12) and inside of which the stem (8) of the disc (7) is housed.

Abstract: An antenna duplexer including an elongated hollow body realized with two opposed half shells is disclosed. The duplexer also includes a first opening or antenna port and a second and a third opening, or ports of the transmitter and of the receiver. A filtering structure is provided including a plurality of metal inserts available to uncouple the transmitter from the receiver. The duplexer has at least an additional portion of waveguide structured in order to keep the wave “under the cut-off frequency”, interposed between at least second or third opening and the relative end wall of the elongated body. An additional portion of wave guide includes an additional metal insert, forming part of the above mentioned filtering structure, which determines an exponential attenuation of the signal, thus nullifying the negative effects deriving from the mechanical tolerance of the hollow body.

Abstract: An electronic package is provided. The electronic package includes a chip carrier having a first conductive layer which includes at least one signal track and at least one contact area, the contact area being electrically connected to the signal track and adapted for transmitting a high-frequency signal. The chip carrier further includes a reference structure having at least two conductive layers such that the signal track is electrically shielded by the reference structure. A semiconductor chip is positioned on the chip carrier and includes at least one terminal electrically interconnected to the at least one contact area.