Patents by Inventor Roberto Serikawa

Roberto Serikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060216514
    Abstract: The present invention intends to provide a diamond-coated silicon to be used in an industrially applicable diamond electrode. A diamond-coated silicon comprising a silicon substrate having a thickness of 500 ?m or less is coated at least partially with electrically conductive diamond. The silicon substrate having a thickness of 500 ?m or less is manufactured by the plate-like crystal growth process, and then the silicon substrate is coated with the electrically conductive diamond by the chemical vapor deposition process to manufacture the diamond-coated silicon. The diamond-coated silicon is flexible and can be stuck to an electrically conductive support substrate, and thereby a large area electrode and a three-dimensional electrode structure can be readily obtained.
    Type: Application
    Filed: December 24, 2003
    Publication date: September 28, 2006
    Applicant: Ebara Corporation
    Inventors: Hiroyuki Fujimura, Roberto Serikawa, Naoki Ishikawa, Takahiro Mishima
  • Publication number: 20060144711
    Abstract: A object of this invention is to provide an electrolytic processing method and apparatus that can suppress a change in the electric conductivity of a fluid due to contaminants, such as processing products produced in electrolytic processing, so that the fluid can maintain good flattening properties.
    Type: Application
    Filed: July 18, 2003
    Publication date: July 6, 2006
    Inventors: Itsuki Kobata, Masayuki Kumekawa, Osamu Nabeya, Roberto Serikawa, Takayuki Saito, Tsukuru Suzuki, Akira Kodera, Hozumi Yasuda, Takeshi Iizumi, Mitsuhiko Shirakashi
  • Publication number: 20060124349
    Abstract: The present invention intends to provide an industrially applicable diamond electrode and a diamond-coated silicon used in the electrode. A silicon substrate having a thickness of 500 ?m or less, at least partially coated with electrically conductive diamond is used as a diamond-coated silicon. In addition, an electrically conductive support substrate and the diamond-coated silicon is used as an electrode. The diamond-coated silicon is flexible and it can be adhered to the electrically conductive support substrate, and thereby a large area electrode and a three-dimensional electrode structure can be easily obtained.
    Type: Application
    Filed: December 24, 2003
    Publication date: June 15, 2006
    Inventors: Hiroyuki Fujimura, Roberto Serikawa, Naoki Ishikawa, Takahiro Mishima