Patents by Inventor Roberto Stanich

Roberto Stanich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6971429
    Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under vacuum, heat and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (200) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained. Featured is a conveyorized vacuum applicator (12) comprising two independent vacuum lamination chambers (18,20) in end-to-end relation. The first vacuum chamber operates at ambient temperature to draw off all of the air entrapped between the dry film resist and the surface of the printed circuit board at conditions that do not result in premature tacking of the dry film to the surface of the board.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: December 6, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Charles R Keil, Osvaldo Novello, Roberto Stanich
  • Patent number: 6610459
    Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under vacuum, heat and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (200) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained. Featured is a conveyorized vacuum applicator (12) comprising two independent vacuum lamination chambers (18,20) in end-to-end relation. The first vacuum chamber operates at ambient temperature to draw off all of the air entrapped between the dry film resist and the surface of the printed circuit board at conditions that do not result in premature tacking of the dry film to the surface of the board.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: August 26, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Charles R. Keil, Osvaldo Novello, Roberto Stanich
  • Publication number: 20030121604
    Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under vacuum, heat and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (200) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained. Featured is a conveyorized vacuum applicator (12) comprising two independent vacuum lamination chambers (18,20) in end-to-end relation. The first vacuum chamber operates at ambient temperature to draw off all of the air entrapped between the dry film resist and the surface of the printed circuit board at conditions that do not result in premature tacking of the dry film to the surface of the board.
    Type: Application
    Filed: December 11, 2002
    Publication date: July 3, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Charles R. Keil, Osvaldo Novello, Roberto Stanich