Abstract: Molded shield structures and method for their fabrication are disclosed. According to one embodiment, a die is attached to a printed circuit board, for example, by using a die attach epoxy. Thereafter, at least one post is attached to the printed circuit board adjacent to the die. The at least one post can be, for example, made of copper or solder-coated ceramic. A shield is then mounted on the at least one post. The shield encloses an area on the printed circuit board which includes the die and may include additional elements, such as passive devices. The shield can be, for example, made of stainless steel, copper, or a copper alloy. In one embodiment, the shield is a wire mesh which can be made of copper or aluminum. After mounting the shield, a molding compound is used to encapsulate the shield, the at least one post, the die, and any additional elements, such as passive devices, that are enclosed by the shield.

Abstract: According to one embodiment, a leadframe having at least one tab is placed inside a mold cavity. During the molding process, the ceiling of the mold cavity is pressed against the at least one tab, which in turn causes a bottom surface of the leadframe to be pressed firmly against a floor of the mold cavity. When a mold compound is injected into the mold cavity, the mold compound is prevented from reaching under the bottom surface of the leadframe. In one embodiment, the tabs are etched into one of the tie bars in the leadframe. The tabs are then mechanically formed at a nonzero angle with respect to a plane of a frame of the leadframe.

Abstract: Structure and method for securing a molding compound to a leadframe paddle is disclosed. Half-holes are etched in the top surface of the leadframe paddle. Moreover, each side of the leadframe paddle is provided with a respective anchor. A die is then attached to the top surface of the leadframe paddle. During the molding process, the molding compound covers the die, the anchors, and fills the half-holes in the top surface of the leadframe paddle. The half-holes cause the molding compound to be locked into the paddle. The half-holes also increase the interface surface area between the molding compound and the top surface of the leadframe paddle. Moreover, during the molding process, the molding compound will encapsulate the anchors provided on each side of the die. When the molding compound hardens around the anchors, the molding compound is reinforced and held in place by the anchors.