Abstract: The present invention generally relates to an architecture for isolating an RF MEMS device from a substrate and driving circuit, series and shunt DVC die architectures, and smaller MEMS arrays for high frequency communications. The semiconductor device has one or more cells with a plurality of MEMS devices therein. The MEMS device operates by applying an electrical bias to either a pull-up electrode or a pull-down electrode to move a switching element of the MEMS device between a first position spaced a first distance from an RF electrode and a second position spaced a second distance different than the first distance from the RF electrode. The pull-up and/or pull-off electrode may be coupled to a resistor to isolate the MEMS device from the substrate.

Abstract: Embodiments of the present invention generally relate to a MEMS device that is anchored using the layer that is deposited to form the cavity sealing layer and/or with the layer that is deposited to form the pull-off electrode. The switching element of the MEMS device will have a flexible or movable portion and will also have a fixed or anchor portion that is electrically coupled to ground. The layer that is used to seal the cavity in which the switching element is disposed can also be coupled to the fixed or anchor portion of the switching element to anchor the fixed or anchor portion within the cavity. Additionally, the layer that is used to form one of the electrodes may be used to provide additional leverage for anchoring the fixed or anchor portion within the cavity. In either situation, the movement of the flexible or movable portion is not hindered.

Abstract: The present invention generally relates to methods for increasing the lifetime of MEMS devices by reducing the landing velocity on switching by introducing gas into the cavity surrounding the switching element of the MEMS device. The gas is introduced using ion implantation into a cavity close to the cavity housing the switching element and connected to that cavity by a channel through which the gas can flow from one cavity to the other. The implantation energy is chosen to implant many of the atoms close to the inside roof and floor of the cavity so that on annealing those atoms diffuse into the cavity. The gas provides gas damping which reduces the kinetic energy of the switching MEMS device which then should have a longer lifetime.

Abstract: The present invention generally relates to a MEMS device having a plurality of cantilevers that are coupled together in an anchor region and/or by legs that are coupled in a center area of the cantilever. The legs ensure that each cantilever can move/release from above the RF electrode at the same voltage. The anchor region coupling matches the mechanical stiffness in all sections of the cantilever so that all of the cantilevers move together.

Abstract: The present invention generally relates to a variable capacitor for RF and microwave applications. The variable capacitor includes a bond pad that has a plurality of cells electrically coupled thereto. Each of the plurality of cells has a plurality of MEMS devices therein. The MEMS devices share a common RF electrode, one or more ground electrodes and one or more control electrodes. The RF electrode, ground electrodes and control electrodes are all arranged parallel to each other within the cells. The RF electrode is electrically connected to the one or more bond pads using a different level of electrical routing metal.

Abstract: The present invention generally relates to RF MEMS devices that are capable of hot switching. The RF MEMS devices, by utilizing one or more spring mechanisms, are capable of hot switching. In certain embodiments, two or more sets of springs may be used that become engaged at specific points in the displacement of the cantilever of the MEMS device. The springs allow for a significant increase in the release voltage for a given pull in landing voltage.

Abstract: Embodiments disclosed herein generally relate to switches that utilize micro-electromechanical systems (MEMS). By replacing transistors in many devices with switches such as MEMS switches, the devices may be used for logic applications. MEMS switches may be used in devices such as FPGAs, NAND devices, nvSRAM devices, AMS chips and general memory logic devices. The benefit of utilizing MEMS devices in place of transistors is that the transistors utilize more space on the chip. Additionally, the MEMS devices can be formed in the BEOL without having any negative impacts on the FEOL or necessitating the use of additional layers within the chip.

Abstract: The present invention generally relates to MEMS devices and methods for their manufacture. The cantilever of the MEMS device may have a waffle-type microstructure. The waffle-type microstructure utilizes the support beams to impart stiffness to the microstructure while permitting the support beam to flex. The waffle-type microstructure permits design of rigid structures in combination with flexible supports. Additionally, compound springs may be used to create very stiff springs to improve hot-switch performance of MEMS devices. To permit the MEMS devices to utilize higher RF voltages, a pull up electrode may be positioned above the cantilever to help pull the cantilever away from the contact electrode.

Abstract: The present invention generally relates to RF MEMS devices that are capable of hot switching. The RF MEMS devices, by utilizing one or more spring mechanisms, are capable of hot switching. In certain embodiments, two or more sets of springs may be used that become engaged at specific points in the displacement of the cantilever of the MEMS device. The springs allow for a significant increase in the release voltage for a given pull in landing voltage.

Abstract: Embodiments disclosed herein generally relate to switches that utilize micro-electromechanical systems (MEMS). By replacing transistors in many devices with switches such as MEMS switches, the devices may be used for logic applications. MEMS switches may be used in devices such as FPGAs, NAND devices, nvSRAM devices, AMS chips and general memory logic devices. The benefit of utilizing MEMS devices in place of transistors is that the transistors utilize more space on the chip. Additionally, the MEMS devices can be formed in the BEOL without having any negative impacts on the FEOL or necessitating the use of additional layers within the chip.

Abstract: Embodiments disclosed herein generally include using a large number of small MEMS devices to replace the function of an individual larger MEMS device or digital variable capacitor. The large number of smaller MEMS devices perform the same function as the larger device, but because of the smaller size, they can be encapsulated in a cavity using complementary metal oxide semiconductor (CMOS) compatible processes. Signal averaging over a large number of the smaller devices allows the accuracy of the array of smaller devices to be equivalent to the larger device. The process is exemplified by considering the use of a MEMS based accelerometer switch array with an integrated analog to digital conversion of the inertial response. The process is also exemplified by considering the use of a MEMS based device structure where the MEMS devices operate in parallel as a digital variable capacitor.

Abstract: Embodiments disclosed herein relate to a non-volatile memory bitcell and arrays thereof, methods of detecting whether the bitcell is in a programmed state, methods of detecting whether the bitcell is in an erased state, methods of setting the bitcell in a programmed state and methods of setting the bitcell in an erased state. The non-volatile memory bitcell may be a four terminal bitcell. The bitcell may have a pull-up electrode, a pull-down electrode, a cantilever electrode and a contact electrode. An NMOS transistor may be coupled to the contact electrode. Depending upon the orientation of the word line, the current through the bitcell may be measured on the bitline, the data line or the pull-down electrode.

Abstract: In one embodiment, a non-volatile memory bitcell includes a program electrode, an erase electrode, a cantilever electrode connected to a bi-stable cantilever positioned between the program electrode and the erase electrode, and switching means connected to the program electrode arranged to apply a voltage potential onto the program electrode, or to detect or to prevent the flow of current from the cantilever to the program electrode. The switching means may comprise a switch having a first node, a second node, and a control node, wherein voltage is applied to the control node to activate the switch to provide a connection between the first node and the second node. The switching means may comprise a pass-gate. The switching means may comprise an NMOS transistor. The switching means may comprise a PMOS transistor. The switching means may comprise a MEMS switch.

Abstract: The micro-electromechanical hinged flap system includes a substantially horizontal substrate and a main flap hinged on one side thereof to the substrate. The system also includes at least one locking flap, preferably two, for securing the main flap in a substantially vertical position. The locking flap is coupled to the substrate by means of a biasing mechanism that continually forces the locking flap toward a position parallel to the substrate. Also provided is a method for assembling a micro-electromechanical hinged flap system. A locking flap is rotated through an acute angle against a biasing force. The biasing force is caused by a biasing mechanism coupling the locking flap to a substrate. A main flap is then raised, whereafter the locking flap is released, such that the biasing force causes the locking flap to engage with the main flap, thereby, securing the main flap in position at the predetermined angle.

Abstract: An optical calibration system calibrates an optical switch containing a mirror having one or more degrees of freedom, an input port receiving an optical signal from an optical signal source, and an output port. The calibration method includes identifying, within a sequence of coarse sweep positions, an initial position of the mirror that directs to the output port a reflected optical signal with at least a predetermined signal strength. A coarse step position of the mirror is then identified, within a sequence of coarse step positions separated by a coarse step size, whereby the reflected optical signal has a maximum signal strength. A fine step position of the mirror is then identified, within a sequence of fine step positions separated by a fine step size, whereby the reflected optical signal has a maximum signal strength. One or more calibration values associated with the identified fine step position are then stored.

Abstract: The micro-electromechanical hinged flap system includes a substantially horizontal substrate and a main flap hinged on one side thereof to the substrate. The system also includes at least one locking flap, preferably two, for securing the main flap in a substantially vertical position. The locking flap is coupled to the substrate by means of a biasing mechanism that continually forces the locking flap toward a position parallel to the substrate. Also provided is a method for assembling a micro-electromechanical hinged flap system. A locking flap is rotated through an acute angle against a biasing force. The biasing force is caused by a biasing mechanism coupling the locking flap to a substrate. A main flap is then raised, whereafter the locking flap is released, such that the biasing force causes the locking flap to engage with the main flap, thereby, securing the main flap in position at the predetermined angle.