Abstract: A method of manufacturing an electronic component assembly is disclosed comprising disposing an electronic component in a housing such that there is at least one void space between the component and the housing, disposing non-conductive microspheres in the void space to substantially fill the void space, and disposing a fluid potting material in the housing and hardening or curing the potting material to pot the component in the housing. An assembly is also disclosed comprising a housing, an electronic component disposed in the housing such that there is at least one space between the component and the housing and the space is substantially filled with non-conductive microspheres, and a material that potting the first electronic component in the housing. The invention enables an electronic component in a housing with a space left between the housing to be potted with reduced formation of bubbles in the hardened potting material.

Abstract: An interface for connecting a transition pipe of an exhaust producing device to a housing of an exhaust treatment device, comprising: a generally spherical structure having a truncated first end and a second end, the truncated first end having an orbicular opening; and a conduit structure having a first end and a second end, the first end of the conduit structure having a generally spherically flared orbicular opening, an inner surface of the conduit structure proximate to the flared orbicular opening of the first end of the conduit structure being secured to an exterior surface of the generally spherical structure proximate to the orbicular opening of the truncated first end to form a fluid passageway through the conduit structure and the generally spherical structure, the truncated first end of the generally spherically structure and the generally spherically flared orbicular opening of the conduit structure each allowing the conduit structure to be angularly offset from a lateral axis through the exhaust t