Abstract: An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.

Abstract: An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.

Abstract: In some embodiments a processor is adapted to store a relationship of power as a function of temperature and voltage, wherein the stored relationship data is to be used for managing power in a system including the processor. Other embodiments are described and claimed.

Abstract: In some embodiments, a memory control device includes a sensor positioned remotely from a memory device, a register to store an offset value, the offset value corresponding to a difference between a temperature reading of the sensor and an estimated actual temperature of the memory device, and a controller to control an operation of the memory device, wherein the controller is configured to read the offset value from the register and control the operation of the memory device in accordance with the offset value. The controller may be configured to dynamically update the offset value during an operation of the memory device. Other embodiments are disclosed and claimed.

Abstract: An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.

Abstract: In some embodiments, a memory control device includes a sensor positioned remotely from a memory device, a register to store an offset value, the offset value corresponding to a difference between a temperature reading of the sensor and an estimated actual temperature of the memory device, and a controller to control an operation of the memory device, wherein the controller is configured to read the offset value from the register and control the operation of the memory device in accordance with the offset value. The controller may be configured to dynamically update the offset value during an operation of the memory device. Other embodiments are disclosed and claimed.

Abstract: An electronic system includes a device and a controller to the device. The controller is adapted to calculate a temperature estimate of the device and to control access to the device in accordance with the calculated temperature estimate.

Abstract: A system may include a first power supply to supply electrical power to the system and a second power supply to supply electrical power to the system. A first airflow gate may be able to reduce airflow to the first power supply when a failure of the first power supply is detected. A second airflow gate may be able to reduce airflow to the second power supply when a failure of the second power supply is detected.

Abstract: An electronic system includes a device and a controller to the device. The controller is adapted to calculate a temperature estimate of the device and to control access to the device in accordance with the calculated temperature estimate.

Abstract: A portion of a chassis comprised of a material forming a portion of the exterior of the chassis and a high-density flexible material adjacent an inner surface of the portion of the chassis with air holes formed contiguously through both the portion of the chassis and the high-density flexible material.

Abstract: A portion of a chassis comprised of a material forming a portion of the exterior of the chassis and a high-density flexible material adjacent an inner surface of the portion of the chassis with air holes formed contiguously through both the portion of the chassis and the high-density flexible material.

Abstract: A cooling fan system has a fan assembly that is removably housed in a chassis. The fan assembly receives electrical power, and the fan blades rotate when housed inside the chassis. As the fan assembly is removed from an opening in the chassis, the power to the fan assembly is disconnected, but the fan blades may continue to rotate. A mechanical stopper, such as a row of bristles that extends into the opening in the chassis, interferes with the rotation of the fan blades as the fan assembly is removed from the chassis. The mechanical stopper stops rotation of the fan blades, thereby preventing harm to the user removing the fan assembly. After the fan assembly is completely removed from the chassis, a spring-loaded door closes the opening in the chassis further protecting the user from contacting adjacent spinning fan blades or hazardous energy sources within the chassis.

Abstract: An improved cooling assembly is disclosed, which includes a chassis enclosing a duct. The duct has a first end and a second end. A first fan is positioned at the first end of the duct and a second fan is positioned at the second end of the duct. A fan failure vent is positioned along a first side of the duct between the first and second fans.