Abstract: A method of conducting a material removal operation using a grinding system including moving an abrasive article relative to a workpiece, detecting a change in a dimension of the abrasive article during moving, and reducing resonance vibrations in the grinding system.

Abstract: A method of conducting a material removal operation using a grinding system including moving an abrasive article relative to a workpiece, detecting a change in a dimension of the abrasive article during moving, and reducing resonance vibrations in the grinding system.

Abstract: A method of forming a mixture including a ceramic material into a sheet, sectioning at least a portion of the sheet using a mechanical object and forming at least one shaped abrasive particle from the sheet, such that the at least one shaped abrasive particle can have a two-dimensional shape as viewed in a plane defined by a length and a width of the shaped abrasive particle selected from the group consisting of polygons, ellipsoids, numerals, Greek alphabet characters, Latin alphabet characters, Russian alphabet characters, complex shapes having a combination of polygonal shapes, and a combination thereof.

Abstract: A method of forming a mixture including a ceramic material into a sheet, sectioning at least a portion of the sheet using a mechanical object and forming at least one shaped abrasive particle from the sheet, such that the at least one shaped abrasive particle can have a two-dimensional shape as viewed in a plane defined by a length and a width of the shaped abrasive particle selected from the group consisting of polygons, ellipsoids, numerals, Greek alphabet characters, Latin alphabet characters, Russian alphabet characters, complex shapes having a combination of polygonal shapes, and a combination thereof.

Abstract: Systems and methods are provided for monitoring and/or controlling laser drilling processes based on atomic emission spectral emissions that are collected in real time during laser drilling. The systems and methods may be used to monitor and control laser drilling operations across a range of materials, e.g., metals (including alloys) and ceramics, and may be used to identify spectral characteristics that signify hole completion and to manage/discontinue laser drilling operations based thereon. The ability to precisely monitor for hole completion provides the important advantage of reducing unnecessary laser pulses, which otherwise could reduce manufacturing efficiency and/or increase thermal or mechanical damage to the component material. The systems and methods may also be employed to control laser drilling operations so as to enhance hole quality and/or to implement corrective action when/if necessary to ensure that laser drilling operations yield high quality drilled holes.

Abstract: Systems and methods are provided for monitoring and/or controlling laser drilling processes based on atomic emission spectral emissions that are collected in real time during laser drilling. The systems and methods may be used to monitor and control laser drilling operations across a range of materials, e.g., metals (including alloys) and ceramics, and may be used to identify spectral characteristics that signify hole completion and to manage/discontinue laser drilling operations based thereon. The ability to precisely monitor for hole completion provides the important advantage of reducing unnecessary laser pulses, which otherwise could reduce manufacturing efficiency and/or increase thermal or mechanical damage to the component material. The systems and methods may also be employed to control laser drilling operations so as to enhance hole quality and/or to implement corrective action when/if necessary to ensure that laser drilling operations yield high quality drilled holes.