Abstract: A semiconductor device may include an embedded device comprising through silicon vias (TSVs) extending from a first surface to a second surface opposite the first surface, wherein the embedded device comprises an active device, a semiconductor die comprising an active surface formed at the first surface, an integrated passive device (IPD), or a passive device. Encapsulant may be disposed over at least five sides of the embedded device. A first electrical interconnect structure may be coupled to a first end of the TSV at the first surface of the embedded device, and a second electrical interconnect structure may be coupled to a second end of the TSV at the second surface of the embedded device. A semiconductor die (e.g. a system on chip (SoC), memory device, microprocessor, graphics processor, or analog device), may be mounted over the first electrical interconnect of the TSV.

Abstract: A semiconductor device may include an embedded device comprising through silicon vias (TSVs) extending from a first surface to a second surface opposite the first surface, wherein the embedded device comprises an active device, a semiconductor die comprising an active surface formed at the first surface, an integrated passive device (IPD), or a passive device. Encapsulant may be disposed over at least five sides of the embedded device. A first electrical interconnect structure may be coupled to a first end of the TSV at the first surface of the embedded device, and a second electrical interconnect structure may be coupled to a second end of the TSV at the second surface of the embedded device. A semiconductor die (e.g. a system on chip (SoC), memory device, microprocessor, graphics processor, or analog device), may be mounted over the first electrical interconnect of the TSV.

Abstract: A method of making a semiconductor device may include providing a large semiconductor die comprising conductive interconnects with a first encapsulant disposed over four side surfaces of the large semiconductor die, over the active surface of the large semiconductor die, and around the conductive interconnects. A first build-up interconnect structure may be formed over the large semiconductor die and over the first encapsulant. Vertical conductive interconnects may be formed over the first build-up interconnect structure and around an embedded device mount site. An embedded device comprising through silicon vias (TSVs) may be disposed over the embedded device mount site. A second encapsulant may be disposed over the build-up structure, and around at least five sides of the embedded device. A second build-up structure may be formed disposed over the planar surface and configured to be electrically coupled to the TSVs of the embedded device and the vertical conductive interconnects.

Abstract: Device and method for teaching/learning music including a board having horizontal lines with spaces therebetween, representing a musical staff. The device includes first insertion slots arranged in the musical staff. The first insertion slots match keys of a keyboard musical instrument. The device includes second insertion slots arranged in parallel to the first insertion slots. Each of the second insertion slots indicates an accidental sign with adjacent first insertion slots. The device includes first pegs configured to insert in the first insertion slots. The device includes second pegs configured to insert in second insertion slots to indicate an accidental sign. The device includes interchangeably clefs individually placed when needed adjacent to the musical staff. The first pegs insert in the first insertion slots, and the second pegs insert in the second insertion slots such that their position indicates a musical tone corresponding to pitch produced by the keyboard musical instrument.

Abstract: An apparatus includes a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams is directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams is directed by the plurality of mirrors is configured to shape the glass substrate.

Abstract: A method includes projecting energy onto an annular edge of a glass substrate. The annular edge includes a first roughness. The first roughness is reduced to a second roughness with the energy. The energy reduces the first roughness without changing a roundness of the annular edge of the glass substrate.

Abstract: A multidimensional recursive and self-perfecting process used to discover dyadic or multi-counterparty relationships between parties, the process comprising: (a) collecting information from a plurality of data sources; (b) discovering dyadic or multi-counterparty relationships between the parties from the collected information; (c) clustering the parties to infer the dyadic or multi-counterparty relationships between the parties based on common or partially intersecting attributes between the parties, thereby forming clustered parties; (d) evaluating the clustered parties for business linkage potential by integrating the collected information and contextually assessing indicia from the data sources to detect and measure consistency and inconsistency for a given party or dyadic or multi-counterparty relationship; (e) positing and evaluating relationship type and role said party plays in each relationship; and (f) assessing the confidence level regarding the likelihood that the dyadic or multi-counterparty rela

Abstract: A system and a method used for data discovery in accordance with an inquiry in which multiple sources, which may be web sites or other data sources, are examined for data relevant to the inquiry. The process and method is performed recursively an indeterminate number of iterations, using data and metadata from multiple sources to corroborate discovered data and metadata from other sources, until no further relevant data or sources are found, or adjudication or exception rules have been met. Discovered data and metadata are curated, adjudicated to assess reliability, synthesized, and clustered into composite records using precedence rules and provenance to determine the most reliable data sources as well as terms of use for each source. Data, metadata, and information about each search are retained and can be used for subsequent purposes, such as subsequent searches or other downstream activities.

Abstract: A corporate linkage system and method provides customers with complete, accurate, and timely lists of corporate linkage locations, including monitoring company lists for changes to location lists, matching stored locations to a company or third party list of locations, providing detailed coding on matches, and batch updates to global files.

Abstract: Muscarinic agonists of the formula (I) with M1 selectivity which are useful as agents for stimulating the cognitive functions of the brain.

Abstract: A vibration dosimeter (2) adapted to monitor whole-body vibration comprising a sensor (6) arranged to continuously measure magnitude of mechanical vibrations received by a person being monitored, means for sampling the vibration measurements (20) produced by the sensor (6), and a processor (10) configured to analyse the vibration measurements and to record an analysis thereof to a data store internal to the dosimeter (2).

Abstract: A data integration method involves a unique method of collecting raw business data and processing it to produce highly useful and highly accurate information to enable business decisions. This process includes collecting global data, entity matching, applying an identification number, performing corporate linkage, and providing predictive indicators. These process steps work in series to filter and organize the raw business data and provide quality information to customers. In addition, the information is enhanced by quality assurance at each step in this process to ensure the high quality of the resulting data.

Abstract: A corporate linkage system and method provides customers with complete, accurate, and timely lists of corporate linkage locations, including monitoring company lists for changes to location lists, matching stored locations to a company or third party list of locations, providing detailed coding on matches, and batch updates to global files.

Abstract: Adenosine analogue-type A3 receptor agonists having an N6 nitrogen substituted by a group which is usually —CH2-CYCLE, where CYCLE is a specified heteroaromatic group, particularly a pyrridyl or a bicyclic group, for example benzoxazole. Preferred CYCLE moieties are substituted in specified positions by, in particular, halo or methyl and, at another position, a dialkylamine.