Abstract: A multi-layer conductive via structure and multi-layer circuit structure containing such multi-layer via structure are described along with the methods for making the structures. The structures include conductive material filled opening(s) located within flexible substrate layers that are supported by an adhesive layer.

Abstract: A normally closed membrane switch is presented which includes a substrate having a cut out area or aperture, a pair of conductive pads located on opposite sides of the aperture, a conductive bridge positioned across the aperture and connecting the pair of conductive pads, and a pill member located on the conductive bridge. The normally closed switch is opened by applying a downward force on the pill member which causes the conductive bridge to flex below the conductive pads. The conductive bridge then pivots against the edges of the substrate which forms the aperture thereby lifting the ends of the conductive bridge off of the conductive pads and opening the switch.