Abstract: The present invention provides new photoresist compositions that comprise a resin binder, a photoactive component, particularly an acid generator, and a dye material that contains one or more chromophores that can reduce undesired reflections of exposure radiation. Preferred dye compounds are polymeric materials that include one or more chromophores such as anthracene and other polycyclic moieties that effectively absorb deep UV exposure radiation.

Abstract: The present invention provides new photoresist compositions that comprise a resin binder, a photoactive component, particularly an acid generator, and a dye material that contains one or more chromophores that can reduce undesired reflections of exposure radiation. Preferred dye compounds are polymeric materials that include one or more chromophores such as anthracene and other polycyclic moieties that effectively absorb deep UV exposure radiation.

Abstract: The present invention provides new photoresist compositions that comprise a resin binder, a photoactive component, particularly an acid generator, and a dye material that contains one or more chromophores that can reduce undesired reflections of exposure radiation. Preferred dye compounds are polymeric materials that include one or more chromophores such as anthracene and other polycyclic moieties that effectively absorb deep UV exposure radiation.

Abstract: A method for making thick-film conductor line patterns having conductor linewidths and spacings which are each less than about 5 mils. The method is especially useful in manufacturing fine-line hybrid circuits. The method involves forming a conductor line circuit pattern of thick-film material on a principle surface of a substrate. The principle surface of the substrate is masked so that selected portions of the conductor line circuit pattern are exposed. The exposed portions of the pattern are then removed from the substrate to reduce the conductor linewidths and spacings of the pattern to less than about 5 mils.