Patents by Inventor Robin L. Willis, Jr.

Robin L. Willis, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microencapsulated platinum-group metals and compounds thereof
    Patent number: 5009957
    Abstract: Platinum-group metals and compounds thereof are microencapsulated within one or two layers of thermoplastic organic polymers. The layer or layers are deposited using known prior art microencapsulation techniques. The microcapsules can be incorporated into storage-stable one-part polyorganosiloxane compositions that cure by a platinum-catalyzed hydrosilation reaction.
    Type: Grant
    Filed: March 23, 1989
    Date of Patent: April 23, 1991
    Assignee: Dow Corning Corporation
    Inventors: Chi-Long Lee, Robin L. Willis, Jr.
  • Microencapsulated platinum-group metals and compounds thereof
    Patent number: 4874667
    Abstract: Platinum-group metals and compounds thereof are microencapsulated within one or two layers of thermoplastic organic polymers. The layer or layers are deposited using known prior art microencapsulation techniques. The microcapsules can be incorporated into storage-stable one-part polyorganosiloxane compositions that cure by a platinum-catalyzed hydrosilation reaction.
    Type: Grant
    Filed: July 20, 1987
    Date of Patent: October 17, 1989
    Assignee: Dow Corning Corporation
    Inventors: Chi-Long Lee, Robin L. Willis, Jr.
  • Method for preparing a microencapsulated compound of a platinum group metal
    Patent number: 4784879
    Abstract: Compounds of metals from the platinum group of the periodic table compounds are encapsulated within a thermoplastic organic polymer using known prior art techniques. The presence of trace amounts of the encapsulated compound on the surface of the microcapsules is avoided by preparing the microcapsules by in-situ polymerization or precipitation of the encapsulant, followed by washing of the microcapsules with a solvent for the encapsulated compound that will not dissolve or swell the encapsulating polymer.
    Type: Grant
    Filed: July 20, 1987
    Date of Patent: November 15, 1988
    Assignee: Dow Corning Corporation
    Inventors: Chi-Long Lee, Robin L. Willis, Jr.
  • Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
    Patent number: 4766176
    Abstract: Storage stable, one part organosiloxane compositions that cure upon heating by a platinum-catalyzed hydrosilation reaction comprise, in addition to the organosiloxane reactants, a platinum-containing hydrosilation catalyst that is microencapsulated within one or two layers of thermoplastic organic polymers. The microcapsules are formed using known techniques.
    Type: Grant
    Filed: July 20, 1987
    Date of Patent: August 23, 1988
    Assignee: Dow Corning Corporation
    Inventors: Chi-long Lee, Donnie R. Juen, John C. Saam, Robin L. Willis, Jr.
  • Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
    Patent number: RE33749
    Abstract: Storage stable, one part organosiloxane compositions that cure upon heating by a platinum-catalyzed hydrosilation reaction comprise, in addition to the organosiloxane reactants, a platinum-containing hydrosilation catalyst that is microencapsulated within one or two layers of thermoplastic organic polymers. The microcapsules are formed using known techniques.
    Type: Grant
    Filed: August 24, 1990
    Date of Patent: November 19, 1991
    Assignee: Dow Corning Corporation
    Inventors: Chi-Long Lee, Donnie R. Juen, John C. Saam, Robin L. Willis, Jr.