Patents by Inventor Robin Lien

Robin Lien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6716651
    Abstract: A wafer/loadport assembly that has a built-in, self-identification system and a method for operating the assembly are described. The wafer cassette is equipped with recessed holes provided with electrically conductive plates for contacting locating pins on a loadport wherein the locating pins are provided with electrically conductive tips for allowing a current to flow through the plate. By different combinations of the electrically conductive tips and the electrically conductive plates provided in the recess holes, the type of wafer cassette can be determined and identified by the process controller.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: April 6, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Martin Weng, Yu-Chih Huang, Jung Huang Peng, Robin Lien
  • Publication number: 20030202866
    Abstract: A wafer/loadport assembly that has a built-in, self-identification system and a method for operating the assembly are described. The wafer cassette is equipped with recessed holes provided with electrically conductive plates for contacting locating pins on a loadport wherein the locating pins are provided with electrically conductive tips for allowing a current to flow through the plate. By different combinations of the electrically conductive tips and the electrically conductive plates provided in the recess holes, the type of wafer cassette can be determined and identified by the process controller.
    Type: Application
    Filed: April 25, 2002
    Publication date: October 30, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Martin Weng, Yu-Chih Huang, Jung Huang Peng, Robin Lien