Patents by Inventor Robin Liu
Robin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240111090Abstract: A device comprises a substrate and an IC die, which may be a photonic IC. The substrate comprises a first surface, a second surface opposite the first surface, an optical waveguide integral with the substrate, and a hole extending from the first surface to the second surface. The hole comprises a first sidewall. The optical waveguide is between the first surface and the second surface, parallel to the first surface, and comprises a first end which extends to the first sidewall. The IC die is within the hole and comprises a second sidewall and an optical port at the second sidewall. The second sidewall is proximate to the first sidewall and the first end of the optical waveguide is proximate to and aligned with the optical port. The substrate may include a recess to receive another device comprising a socket.Type: ApplicationFiled: September 30, 2022Publication date: April 4, 2024Applicant: Intel CorporationInventors: Robert A. May, Tarek Ibrahim, Shriya Seshadri, Kristof Darmawikarta, Hiroki Tanaka, Changhua Liu, Bai Nie, Lilia May, Srinivas Pietambaram, Zhichao Zhang, Duye Ye, Yosuke Kanaoka, Robin McRee
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Publication number: 20240104236Abstract: A method may include determining an threshold user tolerance level associated with one or more sensitive content classifications. The method may include receiving a request to generate a first user account. The method may include receiving one or more instances of first user account data, wherein the one or more instances of first user account data include at least an indication of the first user's age. The method may include generating, based at least in part on the one or more instances of first user account data, the first user account. The method may include configuring, based at least in part on determining that the first user's age fails to satisfy a sensitive content age threshold, one or more first user account settings to restrict sensitive content at or above the threshold user tolerance level.Type: ApplicationFiled: December 22, 2022Publication date: March 28, 2024Inventors: Robin Dsouza, Kayla Marie Schulz, Yi Liu, Kripashankar Mohan, Ashish Upadhyay
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Patent number: 11939430Abstract: Polyphosphate compositions are produced by a process that includes the steps of continuously introducing a phosphate compound into a polymerization vessel, polymerizing the phosphate compound at a temperature of 250-450° C. for a time period sufficient to form the polyphosphate composition, and continuously discharging the polyphosphate composition from the polymerization vessel. The phosphate compound can be fed to the polymerization vessel in the form of an aqueous slurry containing 5-50 wt. % of the phosphate compound. Resulting polyphosphate compositions often contain at least 8 wt. % of a polyphosphate and less than 35 wt. % of the phosphate compound.Type: GrantFiled: March 8, 2021Date of Patent: March 26, 2024Assignee: J.M. Huber CorporationInventors: Yue Liu, Aleksey Isarov, Robin Brumby Helms, Yann Charlotte Bourgeois, James Scott Thomas, Christopher Lamar Duck, Patrick Christopher Farrell
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Patent number: 11926659Abstract: The invention provides antibodies that specifically bind tau. The antibodies inhibit or delay tau-associated pathologies and associated symptomatic deterioration.Type: GrantFiled: February 22, 2021Date of Patent: March 12, 2024Assignee: Prothena Biosciences LimitedInventors: Tarlochan S. Nijjar, Robin Barbour, Philip James Dolan, III, Yue Liu, Svetlana Alexander, Mark E. Renz
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Publication number: 20240078702Abstract: A method for recognizing a reference point associated with a fiducial marker including the steps of: obtaining or receiving image data of the fiducial marker; determining the degree of which the image data of the fiducial marker is aligned with one or more reference images; of which if the degree of alignment is determined to be less than an acceptable threshold predicting a set of coordinates of the reference point associated with the fiducial marker; incorporating the set of coordinates with the image data to form a modified image data; and determining the degree of which the modified image data of the fiducial marker is aligned with one or more reference images.Type: ApplicationFiled: September 5, 2022Publication date: March 7, 2024Inventors: Yi LI, Hong Seung YEON, Nicholas HAEHN, Wei LI, Raquel DE SOUZA BORGES FERREIRA, Minglu LIU, Robin McREE, Yosuke KANAOKA, Gang DUAN, Arnab ROY
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Publication number: 20240080880Abstract: Various embodiments include methods for rotating a control node role among devices in a control cluster of a wireless mesh network. Methods may include assuming the control node role by a first device based on a control node assumption timing in a schedule, and transmitting periodic messages to support the wireless mesh network. Methods may further include using the schedule to identify a control node role end timing and a third device in the control cluster that will assume the control node role, transmitting the periodic messages while monitoring for an extended advertisement from the third device after the control node role end timing until the extended advertisement from the third device is received, and assuming a passive node role upon receiving the extended advertisement from the third device or continuing the control node role when no extended advertisement is received from the third device.Type: ApplicationFiled: September 7, 2022Publication date: March 7, 2024Inventors: Nicolas GRAUBE, Robin ROBIN, Deep Shikha AGGARWAL, Sonu LNU, Randhir KUMAR, Paul Dominic HISCOCK, Mauro SCAGNOL, Tingting LIU, Rahul SANGWAN
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Patent number: 11389798Abstract: Infectious diseases have been sources of large-scale epidemics and pandemics resulting in millions of casualties worldwide. Detection of these biological agents normally involves several lab processes including sample preparation, nucleic acid separation and amplification, and diagnostic analysis. These steps, either performed manually or automated by high-throughput machinery, are tedious, expensive, and highly susceptible to cross-contamination. The present system is an integrated lab-on-a-device designed, developed, and tested in compatibility with a mechanical fixture for sample-to-answer biological analysis of infectious diseases.Type: GrantFiled: March 20, 2019Date of Patent: July 19, 2022Assignee: CHARLES R. DREW UNIVERSITY OF MEDICINE AND SCIENCEInventors: Benjamin Liu, Eva McGhee, Robin Liu, Miguel Nava
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Publication number: 20190291110Abstract: Infectious diseases have been sources of large-scale epidemics and pandemics resulting in millions of casualties worldwide. Detection of these biological agents normally involves several lab processes including sample preparation, nucleic acid separation and amplification, and diagnostic analysis. These steps, either performed manually or automated by high-throughput machinery, are tedious, expensive, and highly susceptible to cross-contamination. The present system is an integrated lab-on-a-device designed, developed, and tested in compatibility with a mechanical fixture for sample-to-answer biological analysis of infectious diseases.Type: ApplicationFiled: March 20, 2019Publication date: September 26, 2019Inventors: Benjamin Liu, Eva McGhee, Robin Liu, Miguel Nava
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Patent number: 9351881Abstract: An eyewear temple arm mounted to an eyewear device, wherein a distal portion of the elongated body member defines a parking structure. A distal edge portion of the structure defines an opening into a cavity thereof which is formed and dimensioned for free sliding, peripheral receipt of at least the proximal portion of a functional element therein between an operational condition and a parked condition. A cover member is configured to cooperate with the parking structure for movement between an opened condition and a closed condition. In the opened condition, the functional element can be moved to the operational condition, while in the closed condition, the cover member extends over the parking structure opening to substantially enclose at least the distal portion of the functional element therein.Type: GrantFiled: July 3, 2014Date of Patent: May 31, 2016Assignee: ReadyMax, Inc.Inventors: Brent Crawford, Bill E. Brauner, Brad Nemeth, Jeff Chen, Robin Liu
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Publication number: 20150340435Abstract: A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal.Type: ApplicationFiled: June 1, 2015Publication date: November 26, 2015Inventors: Benedict C.K. Choy, Ching Chu, Haibing (Robin) Liu, Ming-Yuan Yeh
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Patent number: 9048104Abstract: A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal.Type: GrantFiled: July 12, 2010Date of Patent: June 2, 2015Assignee: Microchip Technology Inc.Inventors: Benedict C. K. Choy, Ching Chu, Haibing (Robin) Liu, Ming-Yuan Yeh
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Publication number: 20150000016Abstract: An eyewear temple arm mounted to an eyewear device, wherein a distal portion of the elongated body member defines a parking structure. A distal edge portion of the structure defines an opening into a cavity thereof which is formed and dimensioned for free sliding, peripheral receipt of at least the proximal portion of a functional element therein between an operational condition and a parked condition. A cover member is configured to cooperate with the parking structure for movement between an opened condition and a closed condition. In the opened condition, the functional element can be moved to the operational condition, while in the closed condition, the cover member extends over the parking structure opening to substantially enclose at least the distal portion of the functional element therein.Type: ApplicationFiled: July 3, 2014Publication date: January 1, 2015Inventors: Brent CRAWFORD, Bill E. BRAUNER, Brad NEMETH, Jeff CHEN, Robin LIU
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Publication number: 20120007216Abstract: A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal.Type: ApplicationFiled: July 12, 2010Publication date: January 12, 2012Inventors: Benedict C. K. Choy, Ching Chu, Haibing (Robin) Liu, Ming-Yuan Yeh
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Patent number: 6523559Abstract: In accordance with the present invention, a microfluidic device and method of using the same is provided for self-regulating the flow of fluid therethrough. The microfluidic device includes a body defining first and second flow channels. The first flow channel has an input for receiving the fluid and an output. The second flow channel has an input for receiving a compensating fluid to modify the value of the property of the fluid and an output communicating with the first flow channel. A polymeric material is disposed in the first flow channel downstream of the output of the second flow channel. The polymeric material has a volume responsive to the value of the property of the fluid. A valve is disposed in the second flow channel and is movable in response to the volume of the material. The valve is movable between the first open position allowing the compensating fluid to flow past the valve into the first flow channel and a second closed position limiting the flow of compensating fluid therepast.Type: GrantFiled: July 27, 2001Date of Patent: February 25, 2003Assignee: Wisconsin Alumni Research FoundationInventors: David J. Beebe, Jeffrey S. Moore, Robin Liu, David T. Eddington