Abstract: A method includes performing a pressing operation on a volume of silicon carbide (SiC) powder to form a polycrystalline SiC (poly-SiC) ingot, and divide the poly-SiC ingot into a plurality of poly-SiC wafer bases. The method further includes, for a respective poly-SiC wafer base, bonding a silicon (Si) wafer structure to the respective poly-SiC wafer base to define a hybrid Si/poly-SiC stack structure, and performing a dividing process to remove a partial thickness of the Si wafer structure from the hybrid Si/poly-SiC stack structure to provide a hybrid Si/poly-SiC wafer comprising a remaining portion of the Si wafer structure bonded to the respective poly-SiC wafer base.

Abstract: Infectious diseases have been sources of large-scale epidemics and pandemics resulting in millions of casualties worldwide. Detection of these biological agents normally involves several lab processes including sample preparation, nucleic acid separation and amplification, and diagnostic analysis. These steps, either performed manually or automated by high-throughput machinery, are tedious, expensive, and highly susceptible to cross-contamination. The present system is an integrated lab-on-a-device designed, developed, and tested in compatibility with a mechanical fixture for sample-to-answer biological analysis of infectious diseases.

Abstract: Infectious diseases have been sources of large-scale epidemics and pandemics resulting in millions of casualties worldwide. Detection of these biological agents normally involves several lab processes including sample preparation, nucleic acid separation and amplification, and diagnostic analysis. These steps, either performed manually or automated by high-throughput machinery, are tedious, expensive, and highly susceptible to cross-contamination. The present system is an integrated lab-on-a-device designed, developed, and tested in compatibility with a mechanical fixture for sample-to-answer biological analysis of infectious diseases.

Abstract: An eyewear temple arm mounted to an eyewear device, wherein a distal portion of the elongated body member defines a parking structure. A distal edge portion of the structure defines an opening into a cavity thereof which is formed and dimensioned for free sliding, peripheral receipt of at least the proximal portion of a functional element therein between an operational condition and a parked condition. A cover member is configured to cooperate with the parking structure for movement between an opened condition and a closed condition. In the opened condition, the functional element can be moved to the operational condition, while in the closed condition, the cover member extends over the parking structure opening to substantially enclose at least the distal portion of the functional element therein.

Abstract: A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal.

Abstract: A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal.

Abstract: An eyewear temple arm mounted to an eyewear device, wherein a distal portion of the elongated body member defines a parking structure. A distal edge portion of the structure defines an opening into a cavity thereof which is formed and dimensioned for free sliding, peripheral receipt of at least the proximal portion of a functional element therein between an operational condition and a parked condition. A cover member is configured to cooperate with the parking structure for movement between an opened condition and a closed condition. In the opened condition, the functional element can be moved to the operational condition, while in the closed condition, the cover member extends over the parking structure opening to substantially enclose at least the distal portion of the functional element therein.

Abstract: A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal.

Abstract: In accordance with the present invention, a microfluidic device and method of using the same is provided for self-regulating the flow of fluid therethrough. The microfluidic device includes a body defining first and second flow channels. The first flow channel has an input for receiving the fluid and an output. The second flow channel has an input for receiving a compensating fluid to modify the value of the property of the fluid and an output communicating with the first flow channel. A polymeric material is disposed in the first flow channel downstream of the output of the second flow channel. The polymeric material has a volume responsive to the value of the property of the fluid. A valve is disposed in the second flow channel and is movable in response to the volume of the material. The valve is movable between the first open position allowing the compensating fluid to flow past the valve into the first flow channel and a second closed position limiting the flow of compensating fluid therepast.