Patents by Inventor Robin Mair
Robin Mair has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240329005Abstract: An opto-acoustic metrology device is configured to measure or inspect structures in a sample using both vertical and lateral transient perturbations. Multiple probe beams that have different locations of incidence may detect both the vertical and lateral transient perturbations produced by a pump beam, or a single probe beam may detect both the vertical and lateral transient perturbations produced by multiple pump beams that have different locations of incidence. The multiple probe beams or multiple pump beams are modulated with orthogonal waveforms, which allow the measurement of the different locations without interference from one another. The received signals are demodulated based on the orthogonal waveforms to recover the contributions to the received signals associated with each of the multiple probe beams or each of the multiple pump beams.Type: ApplicationFiled: March 21, 2024Publication date: October 3, 2024Applicant: Onto Innovation Inc.Inventors: Michael J. Kotelyanskii, Manjusha Mehendale, George Andrew Antonelli, Robin A. Mair
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Patent number: 12092565Abstract: Measuring or inspecting samples through non-destructive systems and methods. Multiple light pulses emitted from a light source. The light pulses are split into pump pulses and probe pulses. A first probe pulse reaches the surface of a sample after a first time duration after a first pump pulse reaches the surface. A second pump pulse reaches the surface after a time duration after the first probe pulse. When the second pump pulse reflects off the sample, the second pump pulse may be altered by an acoustic wave generated by the first probe pulse. The reflected second pump pulse may be analyzed to determine a characteristic of the sample.Type: GrantFiled: May 22, 2020Date of Patent: September 17, 2024Assignee: Onto Innovation Inc.Inventors: Manjusha Mehendale, Marco Alves, Robin Mair
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Patent number: 11988641Abstract: Systems and methods for inspecting or characterizing samples, such as by characterizing patterned features or structures of the sample. In an aspect, the technology relates to a method for characterizing a patterned structure of a sample. The method includes directing a pump beam to a first position on a surface of the sample to induce a surface acoustic wave in the sample and directing a probe beam to a second position on the sample, where the probe beam is affected by the surface acoustic wave when the probe beam reflects from the surface of the sample. The method also includes detecting the reflected probe beam, analyzing the detected reflected probe beam to identify a frequency mode in the reflected probe beam, and based on the identified frequency mode, determining at least one of a width or a pitch of a patterned feature in the sample.Type: GrantFiled: March 30, 2021Date of Patent: May 21, 2024Assignee: Onto Innovation Inc.Inventors: Manjusha Mehendale, Michael Kotelyanskii, Priya Mukundhan, Robin Mair
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Publication number: 20240004311Abstract: An alignment or overlay target that has an optically opaque layer disposed between the top and bottom target structure is measured using opto-acoustic metrology. A classifier library is generated for classifying whether an opto-acoustic metrology signal is on or off the bottom structure. A target may be measured by acquiring opto-acoustic measurement data for the bottom structure of the target and determining a location of the bottom structure using opto-acoustic metrology data acquired from the different locations over the bottom structure and the classifier library. Locations for acquisition of the data may be based on classification results of each measurement and a search pattern. The top structure of the target may be optically imaged. The relative position of the top structure with respect to the bottom structure is determined using the opto-acoustically determined location of the bottom structure and the image of the top structure.Type: ApplicationFiled: November 22, 2021Publication date: January 4, 2024Applicant: Onto Innovation Inc.Inventors: Manjusha Mehendale, George Andrew Antonelli, Priya Mukundhan, Robin A. Mair, Francis C. Vozzo
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Patent number: 11668644Abstract: A non-destructive opto-acoustic metrology device detects the presence and location of non-uniformities in a film stack that includes a large number, e.g., 50 or more, transparent layers. A transducer layer at the bottom of the film stack produces an acoustic wave in response to an excitation beam. A probe beam is reflected from the layer interfaces of the film stack and the acoustic wave to produce an interference signal that encodes data in a time domain from destructive and constructive interference as the acoustic wave propagates upward in the film stack. The data may be analyzed across the time domain to determine the presence and location of one or more non-uniformities in the film stack. An acoustic metrology target may be produced with a transducer layer configured to generate an acoustic wave with a desired acoustic profile based on characteristics of the film stack.Type: GrantFiled: March 30, 2021Date of Patent: June 6, 2023Assignee: Onto Innovation Inc.Inventors: George Andrew Antonelli, Manjusha S. Mehendale, Robin Mair, Nicholas James Keller
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Publication number: 20220317025Abstract: A non-destructive opto-acoustic metrology device detects the presence and location of non-uniformities in a film stack that includes a large number, e.g., 50 or more, transparent layers. A transducer layer at the bottom of the film stack produces an acoustic wave in response to an excitation beam. A probe beam is reflected from the layer interfaces of the film stack and the acoustic wave to produce an interference signal that encodes data in a time domain from destructive and constructive interference as the acoustic wave propagates upward in the film stack. The data may be analyzed across the time domain to determine the presence and location of one or more non-uniformities in the film stack. An acoustic metrology target may be produced with a transducer layer configured to generate an acoustic wave with a desired acoustic profile based on characteristics of the film stack.Type: ApplicationFiled: March 30, 2021Publication date: October 6, 2022Inventors: George Andrew Antonelli, Manjusha S. Mehendale, Robin Mair, Nicholas James Keller
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Publication number: 20220228973Abstract: Measuring or inspecting samples through non-destructive systems and methods. Multiple light pulses emitted from a light source. The light pulses are split into pump pulses and probe pulses. A first probe pulse reaches the surface of a sample after a first time duration after a first pump pulse reaches the surface. A second pump pulse reaches the surface after a time duration after the first probe pulse. When the second pump pulse reflects off the sample, the second pump pulse may be altered by an acoustic wave generated by the first probe pulse. The reflected second pump pulse may be analyzed to determine a characteristic of the sample.Type: ApplicationFiled: May 22, 2020Publication date: July 21, 2022Inventors: Manjusha MEHENDALE, Marco ALVES, Robin MAIR
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Publication number: 20210318270Abstract: Systems and methods for inspecting or characterizing samples, such as by characterizing patterned features or structures of the sample. In an aspect, the technology relates to a method for characterizing a patterned structure of a sample. The method includes directing a pump beam to a first position on a surface of the sample to induce a surface acoustic wave in the sample and directing a probe beam to a second position on the sample, wherein the probe beam is affected by the surface acoustic wave when the probe beam reflects from the surface of the sample. The method also includes detecting the reflected probe beam, analyzing the detected reflected probe beam to identify a frequency mode in the reflected probe beam, and based on the identified frequency mode, determining at least one of a width or a pitch of a patterned feature in the sample.Type: ApplicationFiled: March 30, 2021Publication date: October 14, 2021Applicant: Onto Innovation Inc.Inventors: Manjusha Mehendale, Michael Kotelyanskii, Priya Mukundhan, Robin Mair
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Patent number: 9991176Abstract: Advanced interconnect technologies such as Through Silicon Vias (TSVs) have become an integral part of 3-D integration. Methods and systems and provided for laser-based acoustic techniques in which a short laser pulse generates broadband acoustic waves that propagate in the TSV structure. An optical interferometer detects the surface displacement caused by the acoustic waves reflecting within the structure as well as other acoustic waves traveling near the surface that has information about the structure dimensions and irregularities, such as voids. Features of voids, such as their location, are also identified based on the characteristics of the acoustic wave as it propagates through the via. Measurements typically take few seconds per site and can be easily adopted for in-line process monitoring.Type: GrantFiled: September 29, 2015Date of Patent: June 5, 2018Assignees: Rudolph Technologies, Inc., The Regents of the University of ColoradoInventors: Manjusha Mehendale, Michael Kotelyanskii, Todd W. Murray, Robin Mair, Priya Mukundhan, Jacob D. Dove, Xueping Ru, Jonathan Cohen, Timothy Kryman
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Publication number: 20170221778Abstract: Advanced interconnect technologies such as Through Silicon Vias (TSVs) have become an integral part of 3-D integration. Methods and systems and provided for laser-based acoustic techniques in which a short laser pulse generates broadband acoustic waves that propagate in the TSV structure. An optical interferometer detects the surface displacement caused by the acoustic waves reflecting within the structure as well as other acoustic waves traveling near the surface that has information about the structure dimensions and irregularities, such as voids. Features of voids, such as their location, are also identified based on the characteristics of the acoustic wave as it propagates through the via. Measurements typically take few seconds per site and can be easily adopted for in-line process monitoring.Type: ApplicationFiled: September 29, 2015Publication date: August 3, 2017Applicant: The Regents of the University of ColoradoInventors: Manjusha MEHENDALE, Michael KOTELYANSKII, Todd W. MURRAY, Robin MAIR, Priya MUKUNDHAN, Jacob D. DOVE, Xueping RU, Jonathan COHEN, Timothy KRYMAN
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Patent number: 9576862Abstract: A system and method for identifying one or more characteristics of a structure formed into a substrate is herein disclosed. Surface and bulk acoustic waves are induced in the substrate and travel past a structure of interest where the acoustic waves are sensed. Information concerning one or more characteristics of the structure is encoded in the wave. The encoded information is assessed to determine the characteristic of interest.Type: GrantFiled: February 5, 2014Date of Patent: February 21, 2017Assignees: RUDOLPH TECHNOLOGIES, INC., THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATEInventors: Todd Murray, Manjusha Mehendale, Michael Kotelyanskii, Robin Mair, Priya Mukundhan
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Publication number: 20160043008Abstract: A system and method for identifying one or more characteristics of a structure formed into a substrate is herein disclosed. Surface and bulk acoustic waves are induced in the substrate and travel past a structure of interest where the acoustic waves are sensed. Information concerning one or more characteristics of the structure is encoded in the wave. The encoded information is assessed to determine the characteristic of interest.Type: ApplicationFiled: February 5, 2014Publication date: February 11, 2016Inventors: Todd MURRAY, Manjusha MEHENDALE, Michael KOTELYANSKII, Robin MAIR, Priya MUKUNDHAN
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Publication number: 20120061090Abstract: A landing string assembly (10) comprises a first end (12) adapted to be coupled to a wellhead assembly (14), a second end (16) adapted to be located relative to a surface platform (18), and a pump (34) mounted intermediate the first and second ends (12, 16). In one disclosed embodiment the pump (34) is located adjacent the first end (12), and the string assembly (10) is configured for use in deepwater applications.Type: ApplicationFiled: January 15, 2010Publication date: March 15, 2012Inventors: Andrew Richards, Robin Mair
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Patent number: 7705974Abstract: An optical system includes both a microspot broadband spectroscopic ellipsometer and a photoacoustic film thickness measurement system that are supplied laser light by the same laser light source. One of the systems makes a measurement, the result of which is used to adjust a parameter of the other system; e.g. the ellipsometer measures thickness and the photoacoustic system uses the thickness result to measure the speed of sound. In one version, the ellipsometer converts the laser beam to a broad-spectrum beam that provides higher intensity.Type: GrantFiled: March 11, 2009Date of Patent: April 27, 2010Assignee: Rudolph Technologies, Inc.Inventors: Robert Gregory Wolf, Christopher Morath, Robin Mair
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Publication number: 20090201502Abstract: An optical system includes both a microspot broadband spectroscopic ellipsometer and a photoacoustic film thickness measurement system that are supplied laser light by the same laser light source. One of the systems makes a measurement, the result of which is used to adjust a parameter of the other system; e.g. the ellipsometer measures thickness and the photoacoustic system uses the thickness result to measure the speed of sound. In one version, the ellipsometer converts the laser beam to a broad-spectrum beam that provides higher intensity.Type: ApplicationFiled: March 11, 2009Publication date: August 13, 2009Inventors: Robert Gregory Wolf, Christopher Morath, Robin Mair
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Patent number: 7522272Abstract: An optical system includes both a microspot broadband spectroscopic ellipsometer and a photoacoustic film thickness measurement system that are supplied laser light by the same laser light source. One of the systems makes a measurement, the result of which is used to adjust a parameter of the other system; e.g. the ellipsometer measures thickness and the photoacoustic system uses the thickness result to measure the speed of sound. In one version, the ellipsometer converts the laser beam to a broad-spectrum beam that provides higher intensity.Type: GrantFiled: July 24, 2007Date of Patent: April 21, 2009Assignee: Rudolph Technologies, Inc.Inventors: Robert Gregory Wolf, Christopher Morath, Robin Mair
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Publication number: 20070268478Abstract: An optical system includes both a microspot broadband spectroscopic ellipsometer and a photoacoustic film thickness measurement system that are supplied laser light by the same laser light source. One of the systems makes a measurement, the result of which is used to adjust a parameter of the other system; e.g. the ellipsometer measures thickness and the photoacoustic system uses the thickness result to measure the speed of sound. In one version, the ellipsometer converts the laser beam to a broad-spectrum beam that provides higher intensity.Type: ApplicationFiled: July 24, 2007Publication date: November 22, 2007Inventors: Robert Wolf, Christopher Morath, Robin Mair
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Patent number: 7285031Abstract: FIG. 1 is an exploded view of the invention that consists of a reusable installation guide or router template, (13), which also doubles as a resin dam to secure receptacle, (9), into substrate (19)-(20). Insert (3) resides in receptacle, (9), and accommodates fin, (1), in angled slot (4). The insert, (3), and fin (1), are secured via grub screws, (10), tightened by Allen key (11). This design will accommodate a wide variety of proprietary fins available from numerous manufacturers who bundle their fin mounting systems to be used only with their fins. The fin can be removed, moved laterally within the slot, and canted by changing the insert. The fin is not part of the instant invention.Type: GrantFiled: April 19, 2005Date of Patent: October 23, 2007Inventors: Robin Mair, Mitch Haynie
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Patent number: 7253887Abstract: A photoacoustic system with ellipsometer, where the ellipsometer includes a laser light source for generating an incident beam, an element for focusing the incident beam on a sample, a unit for measuring the change in amplitude of the incident beam on reflection and a unit for measuring the phase difference of the incident beam on reflection. The system further includes an element to convert an input narrow spectrum beam generated by the laser light source to a broadband sample measurement beam that is focused onto the sample.Type: GrantFiled: January 30, 2006Date of Patent: August 7, 2007Assignee: Rudolph Technologies, Inc.Inventors: Robert Gregory Wolf, Christopher Morath, Robin Mair
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Publication number: 20060126057Abstract: A photoacoustic system with ellipsometer, where the ellipsometer includes a laser light source for generating an incident beam, an element for focusing the incident beam on a sample, a unit for measuring the change in amplitude of the incident beam on reflection and a unit for measuring the phase difference of the incident beam on reflection. The system further includes an element to convert an input narrow spectrum beam generated by the laser light source to a broadband sample measurement beam that is focused onto the sample.Type: ApplicationFiled: January 30, 2006Publication date: June 15, 2006Inventors: Robert Wolf, Christopher Morath, Robin Mair