Abstract: A method for removing soldering flux residue from a substrate, such as soldering flux residue formed around solder joints between a chip package and a circuit board, the method including steps of placing the joined circuit board and chip package in isopropyl alcohol to solvate the soldering flux residue, agitating the isopropyl alcohol to break up the soldering flux residue, removing the joined circuit board and chip package from the isopropyl alcohol, drying broken soldering flux residue that is on the joined circuit board and chip package, and spraying the soldering flux residue, that is on the joined circuit board and chip package, with an aqueous cleaner that contains an alkaline compound, to remove broken soldering flux residue that is around the solder joints.

Abstract: A layer of sacrificial, chemically reactive material is formed as part of the fabrication process of an integrated circuit, and covers active circuitry to protect it from reaction with hydrogen. Integrated circuits and fabrication methods are provided by the present invention. The present invention is used to fabricate integrated circuits such as ferroelectric memories, and the like, using die or substrates containing one or more sacrificial layers of strontium bismuth niobate tantalate, for example. The sacrificial layers consume atmospheric hydrogen or other materials that otherwise would react with active circuitry of the integrated circuits and render them ineffective.

Abstract: An endothermic cooler (10) for electronic components (16) in, for example, a missile (12) includes an enclosure (14) having a thermally conductive coupling to the electronic component. A source of water in a first compartment (28) is segregated from salts in a second compartment (30). The salts are capable of providing an endothermic reaction when mixed in a water solution. The two compartments are segregated from one another by a membrane or conduit (32). The membrane is pierced by a spike (34-2 or 34-3) through an actuating mechanism (36) and the conduit is opened by a valve (34-4). Formation of the solution provides cooling for conduction of heat from the electronic component through a thermally conductive plate (24) and its fins (26).

Abstract: An endothermic cooler (10) for electronic components (16) in, for example, a missile (12) includes an enclosure (14) having a thermally conductive coupling to the electronic component. A source of water in a first compartment (28) is segregated from salts in a second compartment (30). The salts are capable of providing an endothermic reaction when mixed in a water solution. The two compartments are segregated from one another by a membrane or conduit (32). The membrane is pierced by a spike (34-2 or 34-3) through an actuating mechanism (36) and the conduit is opened by a valve (34-4). Formation of the solution provides cooling for conduction of heat from the electronic component through a thermally conductive plate (24) and its fins (26).

Abstract: Disclosed is a process for preparing novel multidirectional fiber arrays wherein graphite, glass or other fibers, in unidirectional arrays, are interconnected with polymer fibers. Production is accomplished by mechanical agitation of these unidirectional arrays in cooling polymer solutions. The interconnected material may subsequently be layered, impregnated with resin and laminated to yield unidirectional fiber/resin/polymer fiber composites.

Abstract: Composites, comprising organic polymeric fibers and solid particles, are described which exhibit a wide range of functional characteristics. The materials are light in weight, structurally strong and are air permeable. The fabrication of protective clothing for use in chemical warfare environments is a typical use for which these composites are suitable.