Abstract: A printed circuit board structure for heat dissipation of an integrated circuit includes a printed circuit board having an opening, and a thermal conductive material disposed within the opening, wherein the integrated circuit is disposed over the opening and the thermal conductive material is thermally connected to the integrated circuit. The opening can be designed to have a specific shape to allow the opening to be completely filled by the thermal conductive material during a fillet process, therefore obtaining better heat dissipation performance and protecting the integrated circuit from over heating.