Abstract: A CPU cooling apparatus comprises a rectangular cooling plate and two corrugated cooling fins. The cooling plate has an underside that is attached to an integrated circuit chip for absorbing heat generated by the IC chip in operation. The cooling fins are mounted on the upper surface of the cooling plate such that the cooling fins are parallel to each other. The cooling fins are provided respectively with a plurality of first cooling ducts contiguous to one another and are further provided therebetween a second cooling duct so as to bring about an increase in the cooling area to enhance the cooling efficiency. The apparatus further comprises a cooling fan and a plurality of cooling ducts which are different in orientation from the first cooling ducts and the second cooling duct for maximizing the cooling effect of the apparatus.