Abstract: Disclosed is a device for electrically coupling stocked circuit boards using conductive polymer interconnect material and a spacer element. In one embodiment, coaxial connection is provided by means of an array of wires within undulating metal envelopes. In another embodiment, pins are provided within holes in a plastic spacer. In a third embodiment, wires are laid on a substrate and successive laminations are built up to form the spacer element. In a fourth embodiment, wire arrays are extrusion molded within thermoplastic sheets which are laminated to form the spacer element.

Abstract: Disclosed is an apparatus for the optical interconnection of circuit packs and components mounted on circuit packs, and a method of manufacture. Optical fibers are bonded to a flexible substrate. The substrate includes tabs that can be terminated by standard V-groove silicon chip connectors for optical connection to the edges of circuit packs.

Abstract: Described is a method for assembling multi-fiber array connectors. V-grooved silicon chips are placed in a holder which allows the chips to "float" with respect to each other and adjust to varying fiber diameters. Once the fibers are inserted, the chips are clamped and cemented together with the fibers fixed in the grooves.

Abstract: Disclosed is a connector for optical fibers and components, and a method of manufacture, which provides close alignment. Each fiber is disposed within a plug comprising two blocks placed with their major surfaces in contact. Each block has an array of grooves formed in a major surface for accommodating the fibers. A pair of deeper grooves is also formed in each major surface at opposite edges of each block and at the same time as the array of grooves to form beveled edge surfaces. Guiding rods are disposed against the beveled surfaces so that the rods are rectilinear with the fibers.

Abstract: An electrically heated soldering device adapted to simultaneously heat a plurality of spaced electrical elements in a reflow soldering operation includes an elongated metal laminate of substantially U-shaped cross section having a bight portion between two side portions which may be parallel or divergent. The laminate includes a layer of aluminum between a layer of copper and a layer of stainless steel, with the layers being roll bonded together. The copper and aluminum layers are removed at the bight portion to expose the stainless steel layer and form a heat generating zone for contacting the plurality spaced electrical elements which is corrosion resistant and nonwettable by solder. The edges of the copper and aluminum layers adjacent to the exposed stainless steel bight portion are shaped to impart a selectable temperature profile, either uniform or non-uniform along the length of the bight portion.