Abstract: A bonded article includes a first substrate, a second substrate, and a bonding layer disposed between the first substrate and the second substrate. The bonding layer includes a conducting layer and a capping layer. The first substrate is bonded to the second substrate at a bonded region extending along a bond track. The bonded region is substantially continuous between the first substrate and the second substrate.

Abstract: A glass package includes a glass body with a rim at least partially circumscribing a cavity and a glass lid with a peripheral portion bonded to the rim and a central portion overlying the cavity. A bond between the lid and the body includes interior and exterior perimeter bonds and a filler bond disposed at least partially between the interior and exterior perimeter bonds. The filler bond includes Sa plurality of first bond paths that are substantially parallel to each other and a plurality of second bond paths that are substantially parallel to each other. The plurality of first bond paths and the plurality of second bond paths intersect each other to form a grid pattern.

Abstract: A vacuum insulated glazing can be manufactured using a variety of methods. In one embodiment, a glass substrate is patterned and etched to form recesses in the surface of the glass substrate. The recesses or etched areas form a chamber when the glass substrate is bonded to another glass substrate. In another embodiment, nanoparticles and/or microparticles that absorb laser light are positioned between two glass substrates and heated to bond the glass substrates together. In another embodiment, a tempered glass substrate is bonded to another glass substrate to form a chamber between the substrates. The curved edges of the tempered glass are removed to produce a flat vacuum insulated glazing.

Abstract: A particle micro/nanoparticle filled paste is employed to create an absorbing/sintering interlayer for a bonding process which avoids the need to grind/polish large substrates and eliminates the need for more expensive sputtering process.