Abstract: A method of mask-free printing of dry nanoparticles, the method comprising generating a dry nanoparticle stream from a feedstock material in an atmospheric gas flow using a laser ablation system at atmospheric pressure, the dry nanoparticle stream uncontaminated by a fluidic carrier medium, wherein the dry nanoparticles uncontaminated by a fluidic carrier medium are directed to a substrate through a nozzle by the gas flow in a dry state and adhere to the substrate.

Abstract: The present invention provides a metal powder-polymer matrix film for use in delivering metal powder to a three-dimensional printing process, the matrix comprising at least one metal powder and a polymer sheet, wherein the metal powder is incorporated within the polymer sheet architecture or on the polymer sheet surface, and wherein the polymer sheet has a thickness that is at least half that of the powder thickness.

Abstract: A thermal structure for dissipating heat from a semiconductor substrate has a semiconductor substrate having an external surface which may be roughened. An optional base layer comprising aluminium is formed on top of the external surface by a cold spraying process, and a top layer comprising a matrix of copper and diamond is formed above the substrate, and above the base layer if present, by cold spraying a powder mixture of copper and diamond particles. The top layer is thereby created as a matrix of copper formed by the deformation of the copper particles on impact with the underlying surface and a dispersed phase comprising the diamond particles embedded within the copper matrix. The resulting structure has high thermal conductivity and a coefficient of thermal expansion that is well matched to the substrate, and eliminates the need for a thermal interface material or paste.

Abstract: A thermal structure for dissipating heat from a semiconductor substrate has a semiconductor substrate having an external surface which may be roughened. An optional base layer comprising aluminium is formed on top of the external surface by a cold spraying process, and a top layer comprising a matrix of copper and diamond is formed above the substrate, and above the base layer if en present, by cold spraying a powder mixture of copper and diamond particles. The top layer is thereby created as a matrix of copper formed by the deformation of the copper particles on impact with the underlying surface and a dispersed phase comprising the diamond particles embedded within the copper matrix. The resulting structure has high thermal conductivity and a coefficient of thermal expansion that is well matched to the substrate, and eliminates the need for a thermal interface material or paste.

Abstract: A process and apparatus are disclosed for the deposition of a layer of a first material onto a substrate of a second material. Powder particles of the first material are entrained into a carrier gas flow to form a powder beam directed to impinge on the substrate. This defines a powder beam footprint region at the substrate. The powder beam and the substrate are moved relative to each other to move the powder beam footprint relative to the substrate, thereby to deposit the layer of the first material. A laser is operated to cause direct, local heating of at least one of a forward substrate region and a powder beam footprint region. The laser beam direction is defined with reference to a plane coincident with or tangential to a surface of the substrate at the center of the laser beam footprint in terms of an elevation angle from the plane to the laser beam direction and in terms of an acute azimuthal angle from the movement direction to the laser beam direction.

Abstract: A process and apparatus are disclosed for the deposition of a layer of a first material onto a substrate of a second material. Powder particles of the first material are entrained into a carrier gas flow to form a powder beam directed to impinge on the substrate. This defines a powder beam footprint region at the substrate. The powder beam and the substrate are moved relative to each other to move the powder beam footprint relative to the substrate, thereby to deposit the layer of the first material. A laser is operated to cause direct, local heating of at least one of a forward substrate region and a powder beam footprint region. The laser is controlled to provide a spatial temperature distribution at the powder footprint region of the substrate in which the local temperature of the substrate is in the range 0.5Ts to less than Ts in a volume from the surface of the substrate at least up to a depth of 0.2 mm from the surface of the substrate and not more than 0.

Abstract: A process and apparatus are disclosed for the deposition of a layer of a first material onto a substrate of a second material. Powder particles of the first material are entrained into a carrier gas flow to form a powder beam directed to impinge on the substrate. This defines a powder beam footprint region at the substrate. The powder beam and the substrate are moved relative to each other to move the powder beam footprint relative to the substrate, thereby to deposit the layer of the first material. A laser is operated to cause direct, local heating of at least one of a forward substrate region and a powder beam footprint region. The laser beam direction is defined with reference to a plane coincident with or tangential to a surface of the substrate at the centre of the laser beam footprint in terms of an elevation angle from the plane to the laser beam direction and in terms of an acute azimuthal angle from the movement direction to the laser beam direction.