Abstract: An EMI shield is disclosed for providing EMI protection. The shield is lightweight, and easily moldable into complex shapes, having conductive mating surfaces provided on opposite sides thereof. The clean, highly conductive mating surfaces are part of an embedded aluminum wire mesh sandwiched between at least two face plies which add strength to the shield. By sandwiching the metal mesh alternately with a nonporous tape, and a barrier tape ply, clean conductive areas can be provided on either side of the shield, easing attachment to adjacent structures. During curing, the tapes prevent direct resin inclusion into the metal mesh. After curing, the nonporous tape is removed to expose the clean, highly conductive mating surfaces.

Abstract: A method is disclosed for providing a clean, highly conductive mating surface in a composite panel which includes an embedded aluminum wire mesh to achieve lightning and electromagnetic interference shielding. The method includes the steps of laying a nonporous tape in a mold corresponding with the area requiring a highly conductive mating surface, laying one or more plies of aluminum mesh thereover to provide a conductive path, and then laying a nonporous barrier tape ply above the mating surface, sandwiching the metal mesh therebetween, with structural plies laid thereover. During curing, the tapes prevent direct resin inclusion into the metal mesh. After curing, the nonporous tape is removed to expose the clean, highly conductive mating surface. Utilizing the above-described method substantially increases the ability to provide a clean conductive mating surface without utilizing extensive equipment or processing steps, providing enhanced EMI shielding in composite structures.