Patents by Inventor Rock-Kil Ko
Rock-Kil Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11437169Abstract: The present invention relates to a stacking structure of a superconducting wire. The present invention provides a superconducting wire in which a metal substrate, a buffer layer, a superconducting layer, and a stabilizing layer are stacked, the superconducting wire including: a plurality of wedges which penetrates through the superconducting layer and the buffer layer to connect the stabilizing layer and the metal substrate. According to the present invention, it is possible to provide the superconducting wire of which mechanical strength is improved to have high resistance against to deterioration or delamination. Further, the present invention may provide the superconducting wire which is self-protectable against a quench phenomenon. Further, the present invention may provide the superconducting wire which is suitable for application of a high magnetic field.Type: GrantFiled: September 6, 2016Date of Patent: September 6, 2022Assignee: Korea Electrotechnology Research InstituteInventors: Rock Kil Ko, Dong Woo Ha, Seog Whan Kim, Young Sik Jo
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Patent number: 10861626Abstract: The present invention relates to a superconducting coil having a structure in which an insulation layer electrically insulates the space between adjacent wound wires. The present invention provides a superconducting coil in which superconducting wires extended at a predetermined width in a lengthwise direction are stacked and wound, the superconducting coil comprising a metal-insulator transition (MIT) material layer interposed so as to electrically insulate space between adjacent superconducting wires in the stacking direction of the superconducting wires. According to the present invention, provided is a superconducting coil having high stability, and easily controlling electromagnetic properties including response properties and having a self-protective function against a quench phenomenon and the like during the driving of a magnet.Type: GrantFiled: August 31, 2016Date of Patent: December 8, 2020Assignee: Korea Electrotechnology Research InstituteInventors: Seog Whan Kim, Young Sik Jo, Rock Kil Ko, Dong Woo Ha, Hyung Wook Kim, Chan Park
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Patent number: 10629332Abstract: Provided is a low-temperature superconducting wire having a low stabilizing matrix ratio. The present invention provides a superconducting wire including: a low-temperature superconducting filament; a stabilizing Matrix encompassing the filament; and a sheath of a Metal-Insulator Transition (MIT) material, which encompasses the stabilizing matrix on the exterior of the stabilizing matrix. According to the present invention, a low stabilizing matrix ratio is achieved while coping with heat caused by a quench phenomenon, thereby reducing manufacturing cost and achieving a high current density.Type: GrantFiled: November 22, 2016Date of Patent: April 21, 2020Assignee: KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTEInventors: Young Sik Jo, Rock Kil Ko, Seog Whan Kim, Dong Woo Ha, Hyung Wook Kim, Chil Hoon Doh
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Publication number: 20190228883Abstract: Provided is a low-temperature superconducting wire having a low stabilizing matrix ratio. The present invention provides a superconducting wire including: a low-temperature superconducting filament; a stabilizing Matrix encompassing the filament; and a sheath of a Metal-Insulator Transition (MIT) material, which encompasses the stabilizing matrix on the exterior of the stabilizing matrix. According to the present invention, a low stabilizing matrix ratio is achieved while coping with heat caused by a quench phenomenon, thereby reducing manufacturing cost and achieving a high current density.Type: ApplicationFiled: November 22, 2016Publication date: July 25, 2019Inventors: Young Sik JO, Rock Kil KO, Seog Whan KIM, Dong Woo HA, Hyung Wook KIM, Chil Hoon DOH
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Patent number: 10319500Abstract: Disclosed is a method for manufacturing a superconducting wire material having a laminated structure. The present invention provides a method for manufacturing a laminated superconducting wire material, comprising the steps of: providing a deposition substrate having a predetermined width; sequentially forming, on the deposition substrate, a laminated structure including a buffer layer, a superconducting layer and a stabilization layer, thereby forming, on both sides of the deposition substrate, regions in which a metal substrate is exposed in the width direction; providing a lamination substrate, having a width corresponding to the deposition substrate, to the laminated structure; and providing solder to the regions, in which the metal substrate is exposed, to thereby bond the deposition substrate and the lamination substrate.Type: GrantFiled: December 10, 2013Date of Patent: June 11, 2019Assignee: KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTEInventors: Rock Kil Ko, Seog Whan Kim, Young Sik Jo, Dong Woo Ha
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Publication number: 20190074118Abstract: The present invention relates to a superconducting coil having a structure in which an insulation layer electrically insulates the space between adjacent wound wires. The present invention provides a superconducting coil in which superconducting wires extended at a predetermined width in a lengthwise direction are stacked and wound, the superconducting coil comprising a metal-insulator transition (MIT) material layer interposed so as to electrically insulate space between adjacent superconducting wires in the stacking direction of the superconducting wires. According to the present invention, provided is a superconducting coil having high stability, and easily controlling electromagnetic properties including response properties and having a self-protective function against a quench phenomenon and the like during the driving of a magnet.Type: ApplicationFiled: August 31, 2016Publication date: March 7, 2019Inventors: Seog Whan Kim, Young Sik Jo, Rock Kil Ko, Dong Woo Ha, Hyung Wook Kim, Chan Park
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Publication number: 20190043644Abstract: The present invention relates to a stacking structure of a superconducting wire. The present invention provides a superconducting wire in which a metal substrate, a buffer layer, a superconducting layer, and a stabilizing layer are stacked, the superconducting wire including: a plurality of wedges which penetrates through the superconducting layer and the buffer layer to connect the stabilizing layer and the metal substrate. According to the present invention, it is possible to provide the superconducting wire of which mechanical strength is improved to have high resistance against to deterioration or delamination. Further, the present invention may provide the superconducting wire which is self-protectable against a quench phenomenon. Further, the present invention may provide the superconducting wire which is suitable for application of a high magnetic field.Type: ApplicationFiled: September 6, 2016Publication date: February 7, 2019Inventors: Rock Kil Ko, Dong Woo Ha, Seog Whan Kim, Young Sik Jo
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Publication number: 20160155543Abstract: Disclosed is a method for manufacturing a superconducting wire material having a laminated structure. The present invention provides a method for manufacturing a laminated superconducting wire material, comprising the steps of: providing a deposition substrate having a predetermined width; sequentially forming, on the deposition substrate, a laminated structure including a buffer layer, a superconducting layer and a stabilization layer, thereby forming, on both sides of the deposition substrate, regions in which a metal substrate is exposed in the width direction; providing a lamination substrate, having a width corresponding to the deposition substrate, to the laminated structure; and providing solder to the regions, in which the metal substrate is exposed, to thereby bond the deposition substrate and the lamination substrate.Type: ApplicationFiled: December 10, 2013Publication date: June 2, 2016Applicant: KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTEInventors: Rock Kil KO, Seog Whan KIM, Young Sik JO, Dong Woo HA
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Publication number: 20150248952Abstract: A high-temperature superconducting wire material comprising: a pre-superconducting wire material layer formed by forcibly removing a metal substrate from a superconducting wire material formed by including the metal substrate, a buffer layer formed on the upper surface of the metal substrate and a superconducting conductive layer formed on the upper surface of the buffer layer; a silver (Ag) protective layer formed on the lower surface of the pre-superconducting wire material layer; and a copper (Cu) protective layer formed on the lower surface of the Ag protective layer.Type: ApplicationFiled: May 15, 2015Publication date: September 3, 2015Inventors: Rock-kil Ko, Myung-hwan Sohn, Young-sik Jo, Dong-woo Ha, Boo-min Kang, Dong-hyuk Kim
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Publication number: 20140363582Abstract: Disclosed herein is a method of preparing a yttria solution for a buffer layer of a substrate, including the steps of: (a) mixing yttrium acetate tetrahydrate with methanol to form a mixture and then stirring the mixture; (b) injecting diethanolamine as a chelating agent into the mixture of the step (a) and then stirring the mixture to synthesize a composite; and (c) filtering the composite synthesized in the step (b) using a filter to obtain a sol. The method is advantageous in that the yttria solution prepared in this method is applied onto a substrate to flatten the substrate, and is used to form a diffusion barrier serving as a buffer layer for preventing the diffusion of a substrate material.Type: ApplicationFiled: June 11, 2013Publication date: December 11, 2014Inventors: Rock-kil Ko, Dong-Woo Ha, Myung-hwan Sohn, Dong-hyuk Kim, Boo-min Kang
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Patent number: 8900365Abstract: Disclosed is a deposition apparatus for depositing a specific substance on an elongate substrate such as an elongate strip of tape or film. The apparatus includes a vacuum chamber, supply reel and the for reel for supplying elongate substrate in rolled form, a drum, disposed in the vacuum chamber, the drum having a helically-shaped guide groove formed along an outer surface of the drum for receiving the elongate substrate supplied from the supply reel to be wound in the guide groove and to subsequently feed the elongate substrate to a retreat reel to wind thereon upon rotation of the drum, and a deposition source material for depositing a material onto a surface of the elongate substrate which is wound on the drum.Type: GrantFiled: August 6, 2007Date of Patent: December 2, 2014Assignee: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Kyu Jung Song, Rock Kil Ko, Ho Sup Kim
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Patent number: 8700110Abstract: A rolled superconducting article includes: a cylindrical bobbin having a post in a cylindrical shape; a superconducting strip wound on the cylindrical bobbin in a rolled shape with a predetermined tension applied, wherein the superconducting strip is formed of a superconducting thin film, which is coated with a metal coating layer on a facing surface of the superconducting thin film, and a stabilizing substrate wound on the superconducting strip, wherein the stabilizing substrate is coated with a metal coating layer on a facing surface of the stabilizing substrate; an anti-bonding substrate wound on an outer surface of the stabilizing substrate with a predetermined tension applied; wherein the superconducting thin film is thermally adhered to the stabilizing substrate by heat-treating the rolled superconducting strip with the anti-bonding substrate wound therearound.Type: GrantFiled: May 31, 2012Date of Patent: April 15, 2014Assignee: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Kyu Jung Song, Rock Kil Ko, Ho Seop Kim
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Patent number: 8367585Abstract: Disclosed herein is a superconducting strip having a metal coating layer and a method of manufacturing the superconducting strip.Type: GrantFiled: July 22, 2008Date of Patent: February 5, 2013Assignee: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Kyu Jung Song, Rock Kil Ko, Ho Sup Kim
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Patent number: 8353257Abstract: Disclosed herein is a deposition apparatus with a guide roller for a long superconducting tape. The deposition apparatus has a supply reel which is provided in a vacuum chamber and rotated to supply the tape, a feed and deposition unit which is spaced apart from the supply reel and vacuum deposits a superconducting layer on the tape while feeding the tape, and a collection reel which is spaced apart from the feed and deposition unit and is rotated to collect the vacuum-deposited tape.Type: GrantFiled: July 22, 2008Date of Patent: January 15, 2013Assignee: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Kyu Jung Song, Rock Kil Ko, Ho Sup Kim
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Publication number: 20120283105Abstract: A rolled superconducting article includes: a cylindrical bobbin having a post in a cylindrical shape; a superconducting strip wound on the cylindrical bobbin in a rolled shape with a predetermined tension applied, wherein the superconducting strip is formed of a superconducting thin film, which is coated with a metal coating layer on a facing surface of the superconducting thin film, and a stabilizing substrate wound on the superconducting strip, wherein the stabilizing substrate is coated with a metal coating layer on a facing surface of the stabilizing substrate; an anti-bonding substrate wound on an outer surface of the stabilizing substrate with a predetermined tension applied; wherein the superconducting thin film is thermally adhered to the stabilizing substrate by heat-treating the rolled superconducting strip with the anti-bonding substrate wound therearound.Type: ApplicationFiled: May 31, 2012Publication date: November 8, 2012Applicant: Korea Electrotechnology Research InstituteInventors: Hong Soo HA, Sang Soo OH, Dong Woo HA, Kyu Jung SONG, Rock Kil KO, Ho Sup KIM
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Patent number: 8043716Abstract: Disclosed herein is a gradient thin film, formed on a substrate by simultaneously depositing different materials on the substrate using a plurality of thin film deposition apparatuses provided in a vacuum chamber, wherein the gradient thin film is formed such that the composition thereof is continuously changed depending on the thickness thereof by deposition control plates provided in the path through which the different materials move to the substrate. The gradient thin film is advantageous in that the thin film is formed by simultaneously depositing different materials using various deposition apparatuses, so that the composition thereof is continuously changed depending on the thickness thereof, with the result that the physical properties of a thin film are easily controlled and the number of deposition processes is decreased, and thus processing time and manufacturing costs are decreased, thereby improving economic efficiency.Type: GrantFiled: July 22, 2008Date of Patent: October 25, 2011Assignee: Korea Electrotechnology Research InstituteInventors: Ho Sup Kim, Sang Soo Oh, Tae Hyung Kim, Dong Woo Ha, Kyu Jung Song, Hong Soo Ha, Rock Kil Ko, Nam Jin Lee
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Patent number: 8034746Abstract: Disclosed herein is a method of manufacturing round wire using superconducting tape, including the steps of: slitting superconducting tape into superconducting tape strips; silver-coating the slit superconducting tape strips; laminating the silver-coated superconducting tape strips to form a superconducting tape laminate having a square cross-section; holding the superconducting tape laminate; heat-treating the fixed superconducting tape laminate to cause diffusion junction between silver; and copper-plating the heat-treated superconducting tape laminate to have a circular section.Type: GrantFiled: June 30, 2009Date of Patent: October 11, 2011Assignee: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Rock Kil Ko, Ho Sup Kim
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Patent number: 8026197Abstract: A method and apparatus for manufacturing superconducting tape through an integrated process, including the steps of: heat-treating a substrate wound on a drum in a reaction chamber; continuously depositing components, constituting a buffer layer, a superconducting layer, a contact resistance layer, and a protective layer of the superconducting tape, which are supplied from a deposition chamber, on the substrate; and heat-treating the substrate deposited with the components.Type: GrantFiled: September 28, 2007Date of Patent: September 27, 2011Assignee: Korea Electrotechnology Research InstituteInventors: Ho Seop Kim, Sang Soo Oh, Hong Soo Ha, Kyu Jung Song, Dong Woo Ha, Rock Kil Ko
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Patent number: 7845548Abstract: The present invention is directed to a lamination method. The lamination method includes making the interior of a process chamber a vacuum, the process chamber including a first and a second metal sheet, supplying the first and the second metal sheets, injecting a bonding material between the first and the second metal sheets supplied, bonding the first and the second metal sheets with each other, and heating the bonded metal sheets. The first metal sheet is a superconductive tape, and the second metal sheet is stabilization metal tape.Type: GrantFiled: October 6, 2009Date of Patent: December 7, 2010Inventors: Ho-Sup Kim, Sang-Soo Oh, Tae-Hyung Kim, Kyu-Jeong Song, Hong-Soo Ha, Rock-Kil Ko
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Publication number: 20100137142Abstract: Disclosed herein is a method of manufacturing round wire using superconducting tape, including the steps of: slitting superconducting tape into superconducting tape strips; silver-coating the slit superconducting tape strips; laminating the silver-coated superconducting tape strips to form a superconducting tape laminate having a square cross-section; holding the superconducting tape laminate; heat-treating the fixed superconducting tape laminate to cause diffusion junction between silver; and copper-plating the heat-treated superconducting tape laminate to have a circular section.Type: ApplicationFiled: June 30, 2009Publication date: June 3, 2010Applicant: Korea Electrtechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Rock Kil Ko, Ho Sup Kim