Abstract: An apparatus includes a first circuit and a second circuit. The first circuit may be configured to inject charge into an I-region of a PIN diode in response to a first state of a control signal. The second circuit may be configured to remove charge from the I-region of the PIN diode in response to a second state of the control signal. A radio frequency switching time of the apparatus is generally about two orders of magnitude lower than a carrier lifetime of the PIN diode.

Abstract: An apparatus includes a first circuit and a second circuit. The first circuit may be configured to inject charge into an I-region of a PIN diode in response to a first state of a control signal. The second circuit may be configured to remove charge from the I-region of the PIN diode in response to a second state of the control signal. A radio frequency switching time of the apparatus is generally about two orders of magnitude lower than a carrier lifetime of the PIN diode.

Abstract: An apparatus includes a first circuit and a second circuit. The first circuit may be configured to inject charge into an I-region of a PIN diode in response to a first state of a control signal. The second circuit may be configured to remove charge from the I-region of the PIN diode in response to a second state of the control signal. A radio frequency switching time of the apparatus is generally about two orders of magnitude lower than a carrier lifetime of the PIN diode.

Abstract: A semiconductor component and a method for manufacturing the semiconductor component with low electrical and thermal impedances is provided. The semiconductor component includes a thin semiconductor device with a plurality of layers of various conductivity types forming the active regions and semiconductor/metallic transition layers. The low electrical impedance of the component is achieved by the use of the thin semiconductor device, while the low thermal impedance is provided by a thick pedestal metalization on the semiconductor device.The method for manufacturing such a device includes the fabrication of at least one semiconductor device on one surface of a semiconductor substrate. The second surface of the semiconductor substrate is selectively etched by a controlled process to form a cavity of limited lateral extent adjacent to each of the semiconductor devices on the one surface.