Patents by Inventor Rockwell D. Smith

Rockwell D. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dissimilar adhesive die attach for semiconductor devices
    Patent number: 5304842
    Abstract: A semiconductor assembly comprises a semiconductor die which is attached by a carrier material to a lead frame. The carrier material is coated on the die side with one type of adhesive and on the lead frame side with a different adhesive. The lead frame has a small surface area to connect to the carrier material, while the semiconductor die has a large surface area to connect to the carrier material. As used with one inventive embodiment, the adhesive between the die and the carrier softens at a low temperature preventing the die from cracking at elevated temperatures. The adhesive on the lead frame side of the carrier material softens at a higher temperature than the adhesive of the die side of the adhesive, thereby firmly connecting the lead frame having a small surface area to the carrier.
    Type: Grant
    Filed: June 26, 1992
    Date of Patent: April 19, 1994
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Rockwell D. Smith, Walter L. Moden