Patents by Inventor Rockwell M. Hsu

Rockwell M. Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive interconnects along the edge of a microelectronic device
    Patent number: 7750441
    Abstract: Embodiments of the invention include apparatuses and methods relating to conductive interconnects along the edges of a microelectronic device. In one embodiment, the conductive interconnect has the shape of a half cylinder.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: July 6, 2010
    Assignee: Intel Corporation
    Inventors: Rockwell M. Hsu, Thomas S. Dory
  • Conductive interconnects along the edge of a microelectronic device
    Publication number: 20080001269
    Abstract: Embodiments of the invention include apparatuses and methods relating to conductive interconnects along the edges of a microelectronic device. In one embodiment, the conductive interconnect has the shape of a half cylinder.
    Type: Application
    Filed: June 29, 2006
    Publication date: January 3, 2008
    Inventors: Rockwell M. Hsu, Thomas S. Dory