Patents by Inventor Rocky L. Hilburn

Rocky L. Hilburn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper on polymer component having improved adhesion
    Publication number: 20030039760
    Abstract: A component for use in manufacturing electronic interconnection devices, comprised of a polyimide film having a thickness of between about 12 &mgr;m and about 125 &mgr;m. A chromium tiecoat on a surface of the polyimide film, the chromium tiecoat having a thickness of between about 300 Å and about 350 Å and a copper layer on the tiecoat, the copper layer having a thickness between about 300 Å and about 70 &mgr;m.
    Type: Application
    Filed: September 27, 2002
    Publication date: February 27, 2003
    Applicant: Gould Electronics Inc.
    Inventors: Tad R. Bergstresser, Rocky L. Hilburn, Jerome S. Sallo