Patents by Inventor Rod Lee

Rod Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8107200
    Abstract: A slider mounted CPP GMR or TMR read head sensor is protected from electrostatic discharge (ESD) damage and from noise and cross-talk from an adjacent write head by means of a balanced resistive/capacitative shunt. The shunt includes highly resistive interconnections between upper and lower shields of the read head and a grounded slider substrate and a low resistance interconnection between the lower pole piece of the write head and the substrate. The capacitances between the pole piece and the upper shield, the upper shield and the lower shield and the lower shield and the substrate are made equal by either forming the shields and pole piece with equal surface areas and separating them with dielectrics of equal thicknesses, or by keeping the ratio of area to insulator thicknesses equal.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: January 31, 2012
    Assignees: Headway Technologies, Inc., SAE Magnetics (HK) Ltd.
    Inventors: Eric Cheuk Wing Leung, Anthony Wai Yuen Lai, Pak Kin Wong, David Hu, Moris Dovek, Rod Lee
  • Publication number: 20080259506
    Abstract: A slider mounted CPP GMR or TMR read head sensor is protected from electrostatic discharge (ESD) damage and from noise and cross-talk from an adjacent write head by means of a balanced resistive/capacitative shunt. The shunt includes highly resistive interconnections between upper and lower shields of the read head and a grounded slider substrate and a low resistance interconnection between the lower pole piece of the write head and the substrate. The capacitances between the pole piece and the upper shield, the upper shield and the lower shield and the lower shield and the substrate are made equal by either forming the shields and pole piece with equal surface areas and separating them with dielectrics of equal thicknesses, or by keeping the ratio of area to insulator thicknesses equal.
    Type: Application
    Filed: June 19, 2008
    Publication date: October 23, 2008
    Inventors: Eric Cheuk Wing Leung, Anthony Wai Yuen Lai, Pak Kin Wong, David Hu, Moris Dovek, Rod Lee
  • Patent number: 7392579
    Abstract: A slider mounted CPP GMR or TMR read head sensor is protected from electrostatic discharge (ESD) damage and from noise and cross-talk from an adjacent write head by means of a balanced resistive/capacitative shunt. The shunt includes highly resistive interconnections between upper and lower shields of the read head and a grounded slider substrate and a low resistance interconnection between the lower pole piece of the write head and the substrate. The capacitances between the pole piece and the upper shield, the upper shield and the lower shield and the lower shield and the substrate are made equal by either forming the shields and pole piece with equal surface areas and separating them with dielectrics of equal thicknesses, or by keeping the ratio of area to insulator thicknesses equal.
    Type: Grant
    Filed: March 7, 2005
    Date of Patent: July 1, 2008
    Assignees: Headway Technologies, Inc., SAE Magnetics (HK) Ltd.
    Inventors: Eric Cheuk Wing Leung, Anthony Wai Yuen Lai, Pak Kin Wong, David Hu, Moris Dovek, Rod Lee
  • Patent number: 7320168
    Abstract: Problems such as thermal pole tip protrusion result from thermal mismatch between the alumina and pole material during the writing process. This, and similar problems due to inadequate heat dissipation, have been overcome by dividing the bottom shield into two pieces both of which sit on top of a non-magnetic heat sink. Heat generated by the coil during writing is transferred to the non-magnetic heat sink whence it gets transferred to the substrate. With this approach, the head not only benefits from less field disturbance due to the small shield but also improves heat dissipation from the additional heat sink.
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: January 22, 2008
    Assignee: Headway Technologies, Inc.
    Inventors: Cherng-Chyi Han, Rod Lee, Mao-Min Chen, Pokang Wang
  • Patent number: 7154708
    Abstract: A magnetic read/write head and slider assembly and method for forming said magnetic read/write head and slider assembly, wherein said assembly has improved heat spreading and dissipation properties and exhibits significantly reduced thermal protrusion during operation. The method of formation is simple and efficient, involving only the extension of one of the conductive mounting pads so that it is in thermal contact with a portion of the slider assembly surface that is over the read/write element.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: December 26, 2006
    Assignee: Headway Technologies, Inc.
    Inventors: Devendra S. Chhabra, Rod Lee, Glen Garfunkel, Mor Dovek, Cherng-Chyi Han
  • Publication number: 20060198057
    Abstract: A slider mounted CPP GMR or TMR read head sensor is protected from electrostatic discharge (ESD) damage and from noise and cross-talk from an adjacent write head by means of a balanced resistive/capacitative shunt. The shunt includes highly resistive interconnections between upper and lower shields of the read head and a grounded slider substrate and a low resistance interconnection between the lower pole piece of the write head and the substrate. The capacitances between the pole piece and the upper shield, the upper shield and the lower shield and the lower shield and the substrate are made equal by either forming the shields and pole piece with equal surface areas and separating them with dielectrics of equal thicknesses, or by keeping the ratio of area to insulator thicknesses equal.
    Type: Application
    Filed: March 7, 2005
    Publication date: September 7, 2006
    Inventors: Eric Leung, Anthony Lai, Pak Wong, David Hu, Moris Dovek, Rod Lee
  • Publication number: 20050237667
    Abstract: A magnetic read/write head and slider assembly and method for forming said magnetic read/write head and slider assembly, wherein said assembly has improved heat spreading and dissipation properties and exhibits significantly reduced thermal protrusion during operation. The method of formation is simple and efficient, involving only the extension of one of the conductive mounting pads so that it is in thermal contact with a portion of the slider assembly surface that is over the read/write element.
    Type: Application
    Filed: June 30, 2005
    Publication date: October 27, 2005
    Inventors: Devendra Chhabra, Rod Lee, Glen Garfunkel, Moris Dovek, Cherng-Chyi Han
  • Patent number: 6928721
    Abstract: A method of fabricating a magnetic read/write head and slider assembly, wherein the assembly has improved heat spreading and dissipation properties and the read/write head exhibits significantly reduced thermal protrusion during operation. The method of fabrication is simple and efficient, involving only the extension of at least one of the conductive mounting pads so that it is in thermal contact with a portion of the slider surface that is directly above the read/write element.
    Type: Grant
    Filed: October 5, 2001
    Date of Patent: August 16, 2005
    Assignee: Headway Technologies, Inc.
    Inventors: Devendra S. Chhabra, Rod Lee, Glen Garfunkel, Moris Dovek, Cherng-Chyi Han
  • Publication number: 20050094319
    Abstract: Problems such as thermal pole tip protrusion result from thermal mismatch between the alumina and pole material during the writing process. This, and similar problems due to inadequate heat dissipation, have been overcome by dividing the bottom shield into two pieces both of which sit on top of a non-magnetic heat sink. Heat generated by the coil during writing is transferred to the non-magnetic heat sink whence it gets transferred to the substrate.
    Type: Application
    Filed: October 29, 2003
    Publication date: May 5, 2005
    Inventors: Cherng-Chyi Han, Rod Lee, Mao-Min Chen, Pokang Wang
  • Patent number: 6665154
    Abstract: Spin valve heads with overlaid leads have several advantages over butted contiguous junction designs, including larger signal output and better head stability. However, in any overlaid design there is always present at least one high resistance layer between the GMR layer and the conductive leads. This leads to an effective read width that is greater than the actual physical width. This problem has been overcome by inserting a highly conductive channeling layer between the GMR stack and the conducting lead laminate. This arrangement ensures that, at the intersection between the leads and the GMR stack, virtually all the current moves out of the free layer into the leads thereby providing an effective read width for the device that is very close to the physical read width defined by the spacing between the two leads. A process for manufacturing the device is also described.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: December 16, 2003
    Assignee: Headway Technologies, Inc.
    Inventors: Kochan Ju, You Feng Zheng, Rod Lee
  • Publication number: 20030067716
    Abstract: A magnetic read/write head and slider assembly and method for forming said magnetic read/write head and slider assembly, wherein said assembly has improved heat spreading and dissipation properties and exhibits significantly reduced thermal protrusion during operation. The method of formation is simple and efficient, involving only the extension of one of the conductive mounting pads so that it is in thermal contact with a portion of the slider assembly surface that is over the read/write element.
    Type: Application
    Filed: October 5, 2001
    Publication date: April 10, 2003
    Applicant: Headway Technologies, Inc.
    Inventors: Devendra S. Chhabra, Rod Lee, Glen Garfunkel, Moris Dovek, Cherng-Chyi Han
  • Publication number: 20030035250
    Abstract: Spin valve heads with overlaid leads have several advantages over butted contiguous junction designs, including larger signal output and better head stability. However, in any overlaid design there is always present at least one high resistance layer between the GMR layer and the conductive leads. This leads to an effective read width that is greater than the actual physical width. This problem has been overcome by inserting a highly conductive channeling layer between the GMR stack and the conducting lead laminate. This arrangement ensures that, at the intersection between the leads and the GMR stack, virtually all the current moves out of the free layer into the leads thereby providing an effective read width for the device that is very close to the physical read width defined by the spacing between the two leads. A process for manufacturing the device is also described.
    Type: Application
    Filed: August 17, 2001
    Publication date: February 20, 2003
    Applicant: Headway Technologies, Inc.
    Inventors: Kochan Ju, You Feng Zheng, Rod Lee