Abstract: Backgrinding a semiconductor wafer includes planarizing backgrind tape without requiring cutting the tape. A semiconductor substrate is provided with an active top surface and a back surface. The active top surface includes a plurality of bumps that connect to devices formed in or on the substrate. A backgrind tape is applied over the top surface of the substrate. The backgrind tape covers the bumps and extends to a periphery of the top surface. The top surface of the substrate is placed so that the backgrind tape is positioned on a chuck table of a backgrind apparatus. Pressure is applied to the back surface of the substrate forcing the backgrind tape against the chuck table. The pressure is removed after a predetermined interval. Backgrinding is performed on the back surface of the substrate to reach a target substrate thickness.