Abstract: A method includes obtaining a photosensor substrate (236) having two opposing major surfaces. One of the two opposing major surfaces includes at least one photosensor row (230) of at least one photosensor element (232, 234), and the obtained photosensor substrate has a thickness equal to or greater than one hundred microns. The method further includes optically coupling a scintillator array (310) to the photosensor substrate. The scintillator array includes at least one complementary scintillator row (224) of at least one complementary scintillator element (226, 228), and the at least one complementary scintillator row is optically coupled to the at least one photosensor row (230) and the at least one complementary scintillator element is optically coupled to the at least one photosensor element.

Abstract: An imaging system (300) includes a radiation source (308) that emits radiation from a focal spot (312) in a direction of an examination region. The imaging system further includes a beam shaper (314), located between the focal spot and the examination region, that shapes an x-ray transmission profile of the radiation emitted from the source and incident on the beam shaper such that the radiation leaving the beam shaper has a pre-determined transmission profile.

Abstract: A method includes obtaining a photosensor substrate (236) having two opposing major surfaces. One of the two opposing major surfaces includes at least one photosensor row (230) of at least one photosensor element (232, 234), and the obtained photosensor substrate has a thickness equal to or greater than one hundred microns. The method further includes optically coupling a scintillator array (310) to the photosensor substrate. The scintillator array includes at least one complementary scintillator row (224) of at least one complementary scintillator element (226, 228), and the at least one complementary scintillator row is optically coupled to the at least one photosensor row (230) and the at least one complementary scintillator element is optically coupled to the at least one photosensor element.

Abstract: A method includes obtaining a photosensor substrate (236) having two opposing major surfaces. One of the two opposing major surfaces includes at least one photosensor row (230) of at least one photosensor element (232, 234), and the obtained photosensor substrate has a thickness equal to or greater than one hundred microns. The method further includes optically coupling a scintillator array (310) to the photosensor substrate. The scintillator array includes at least one complementary scintillator row (224) of at least one complementary scintillator element (226, 228), and the at least one complementary scintillator row is optically coupled to the at least one photosensor row (230) and the at least one complementary scintillator element is optically coupled to the at least one photosensor element.

Abstract: An imaging detector (214) includes a scintillator array (216) including a scintillator element (228) and a material (230) and a photosensor array (218) including a detector element (222) having a light sensitive region (224) and a non-sensitive region (226). The light sensitive region is separated from the scintillator element by a gap, the light sensitive region is in one-to-one mechanical alignment with the scintillator element, and the non-sensitive region is in mechanical alignment with the material. The detector further includes structure (234) that includes one or more material free channels. The structure is located between the non-sensitive region and the material and not between the light sensitive region and the scintillator element. An optical adhesive (232) is located in the gap, filling the entire gap, and mechanically and optically coupling the light sensitive region and the scintillator element.

Abstract: An imaging system (300) includes a radiation source (308) that emits radiation from a focal spot (312) in a direction of an examination region. The imaging system further includes a beam shaper (314), located between the focal spot and the examination region, that shapes an x-ray transmission profile of the radiation emitted from the source and incident on the beam shaper such that the radiation leaving the beam shaper has a pre-determined transmission profile.

Abstract: An imaging detector (214) includes a scintillator array (216) including a scintillator element (228) and a material (230) and a photosensor array (218) including a detector element (222) having a light sensitive region (224) and a non-sensitive region (226). The light sensitive region is separated from the scintillator element by a gap, the light sensitive region is in one-to-one mechanical alignment with the scintillator element, and the non-sensitive region is in mechanical alignment with the material. The detector further includes structure (234) that includes one or more material free channels. The structure is located between the non-sensitive region and the material and not between the light sensitive region and the scintillator element. An optical adhesive (232) is located in the gap, filling the entire gap, and mechanically and optically coupling the light sensitive region and the scintillator element.

Abstract: A method includes obtaining a photosensor substrate (236) having two opposing major surfaces. One of the two opposing major surfaces includes at least one photosensor row (230) of at least one photosensor element (232, 234), and the obtained photosensor substrate has a thickness equal to or greater than one hundred microns. The method further includes optically coupling a scintillator array (310) to the photosensor substrate. The scintillator array includes at least one complementary scintillator row (224) of at least one complementary scintillator element (226, 228), and the at least one complementary scintillator row is optically coupled to the at least one photosensor row (230) and the at least one complementary scintillator element is optically coupled to the at least one photosensor element.